Research Progress on Structural Evolution Mechanism and Multi-dimensional Characterization of Laser-induced Modification for Through Glass Vias

doi:10.15541/jim20260309

Abstract

Abstract: Through Glass Vias (TGV), with their excellent high-frequency electrical properties, good process compatibility, and low-cost integration advantages, have become one of the key interconnection technologies replacing traditional silicon through-silicon vias in the field of advanced packaging. Laser-induced deep etching (LIDE) achieves the fabrication of high-aspect-ratio vias through laser modification and selective wet etching. Its core scientific problem lies in how optical field energy deposition drives the structural evolution of the glass network, and how these structural changes determine the subsequent etching selectivity and via quality. Based on the research progress of laser-glass interactions, this paper primarily reviews the structural evolution of TGV modification and its multi-dimensional characterization methods. First, the paper analyzes the application features of beam shaping technologies such as Gaussian beams, laser filaments, and Bessel beams in TGV fabrication, highlighting the advantages and limitations of Bessel beams in deep-focus and high-consistency via processing. Secondly, it explores the physicochemical processes of laser-induced glass modification, covering three main stages: multiphoton/tunnel ionization, localized thermal effects, and structural modification, and reveals the kinetic mechanism by which the modified regions achieve a high selectivity ratio during wet etching. At the same time, multi-dimensional characterization techniques ranging from macroscopic morphology to atomic scale and spectroscopy are summarized, clarifying their key role in analyzing the microstructural evolution and defect formation mechanisms in the modified regions. Finally, the paper addresses the current limitations and challenges in research on laser-induced glass via modification mechanisms and characterization methods, and envisions future development trends and key research directions in this field.

Key words: through glass vias, advanced packaging, laser-induced, structural evolution mechanism, multi-dimensional characterization, review

CLC Number:

TN405

ZHAO Zejia, CAI Zibo, REN Yonghui, BI Wenzhong, ZHU Qinggong, REN Haishen, LIU Wanchao, LIN Huixing. Research Progress on Structural Evolution Mechanism and Multi-dimensional Characterization of Laser-induced Modification for Through Glass Vias[J]. Journal of Inorganic Materials, DOI: 10.15541/jim20260309.

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