Journal of Inorganic Materials ›› 2015, Vol. 30 ›› Issue (12): 1283-1290.DOI: 10.15541/jim20150150

• Orginal Article • Previous Articles     Next Articles

Effect of Continuous-distribution Inter-phase on the Thermal Conductivity of SiCp/Al Composites by Numerical Simulation Method

ZOU Ai-Hua1, 2, ZHOU Xian-Liang1, 2, HUA Xiao-Zhen2, WU Kai-Yang2   

  1. (1. School of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China; 2. School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China)
  • Received:2015-03-26 Revised:2015-07-09 Published:2015-12-20 Online:2015-11-24
  • About author:ZOU Ai-Hua. E-mail: aihua553030@163.com
  • Supported by:
    National Natural Science Foundation of China (51166011);Aviation Science Foundation (2012ZF56024);Key Laboratory for Microstructural Control of Metallic Materials of Jiangxi Province (Nanchang Hangkong University) (JW201423003)

Abstract:

Thermal conductivity of SiC particles-reinforced Al matrix (SiCp/Al) composites was simulated by finite element method (FEM), in which the models of SiC particles coated with inter-phase in the aluminum matrix was established. The effects of inter-phase types and thickness on the thermal conductivity of composites were investigated. The results show that, when the inter-phase combines ideally with SiC and Al which distributes continuously on the surface of SiCp, the thermal conductivity of composites inter-phase acts like a role of iner-layer. With increase of thermal conductivity of inter-layer, the thermal conductivity of the composites increases quickly at first and slowly afferwards. The variation of thermal conductivity of the composites depends on the ratio of inter-layer thickness (t) to the SiCp diameter (a). When the t/a value is very small or very large, the variation of the thermal conductivity is very small, while t/a is small, the variation of thermal conductivity of the composites is related to thermal conductivity of the inter-layer.

Key words: SiCp/Al composites, finite element method, inter-phase, thermal conductivity

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