Synthesis and Characterization of SiC@SiO2/BN/PI Composites by in-situ Polymerization

doi:10.15541/jim20200360

Abstract

Abstract:

Polyimide composites have attracted more and more attention due to their excellent properties and wide application prospects in aerospace, rail transit, microelectronics and other fields. SiC@SiO₂ whisker was prepared by oxidation of SiC whisker at 750 ℃, which formed mixed fillers with BN particles. The SiC@SiO₂ whisker and BN were modified by a silane coupling agent and a titanate coupling agent, respectively. SiC@SiO₂/BN/PI composites were prepared by in-situ polymerization. The structure and property of the fillers and composites were characterized. Whiskers and particles formed an effective pathway in the polyimide matrix, which promoted continuous improvement of the thermal conductivity of SiC@SiO₂/BN/PI composites. When the total filler content was 45wt% and the mass ratio of whiskers to particles was 4 : 1, the thermal conductivity was increased to 0.95 W/(m·K). Mechanical properties of SiC@SiO₂/BN/PI composites changed regularly with the type and amount of mixed fillers. The SiO₂ layer blocks the communication of free electrons between the mixed fillers, and the decreasing range of electrical insulation performance of the SiC@SiO₂/BN/PI composites declined.

Key words: polyimide, mixed filler, thermal conductivity, electric insulation property

CLC Number:

TQ170
TB34

GAO Jiming, YANG Yang, LEI Ting, WANG Jin, LIU Jie, ZHANG Limin. Synthesis and Characterization of SiC@SiO₂/BN/PI Composites by in-situ Polymerization[J]. Journal of Inorganic Materials, 2021, 36(1): 36-42.

Figures/Tables 8

Fig. 1 XRD patterns of the SiC whiskers oxidized at different temperatures for different time

Fig. 2 TEM images of SiC whiskers oxidized at 750 ℃ for (a) 30, (b) 60 and (c) 90 min, and (d) 800 ℃ for 60 min

Fig. 3 FT-IR spectra of (a) BN and modified-BN; (b) SiC@SiO2 and modified-SiC@SiO2

Fig. 4 SEM images of fracture surfaces of SiC@SiO2/BN/PI composites with 20wt% mixed fillers m(BN):m(SiC@SiO2) (a) 5 : 0; (b) 4 : 1; (c) 3 : 2; (d) 2 : 3; (e) 1 : 4; (f) 0 : 5

Fig. 5 Thermal conductivity of composites with different weight ratio of BN flakes to SiC@SiO2 whiskers at filler content of 20wt%

Fig. 6 Thermal conductivity of composites with different filler contents when the weight ratio of BN to SiC@SiO2 is 1 : 4.

Fig. 7 Mechanical properties of SiC@SiO2/BN/PI composites (a) Different weight ratios of BN to SiC@SiO2 at filler content of 20wt%; (b) Different filler contents when the weight ratio of BN to SiC@SiO2 is 1 : 4.

Fig. 8 Surface resistivities and volume resistivities of the SiC@SiO2/BN/PI composites (a) Different weight ratios of BN to SiC@SiO2 at filler content of 20wt %; (b) Different filler contents when the weight ratio of BN to SiC@SiO2 is 1 : 4.

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Synthesis and Characterization of SiC@SiO₂/BN/PI Composites by in-situ Polymerization

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