Thermal Conductivity of Electric Molding Composites Filled with β-Si3N4

doi:10.3724/SP.J.1077.2007.01201

Abstract

Abstract: New electric molding composites were fabricated with hybridizing epoxy and β-Si₃N₄instead of silica. The thermal conductivity of composites filled with β-Si₃N₄ was compared with that co-filled with β-Si₃N₄and SiO₂. The results demonstrate that the thermal conductivity of the composite increases obviously with the increasing of β-Si3N4 content. Thermal conductivity of β-Si₃N₄-filled composite is about 3.8 times as large as that of SiO₂-filled one when the additional volume fraction achieves to 50%. Based on the experimental results, the discussion of calculating model for predicting thermal conductivity of composites shows that Agari model is more applicable to predict the thermal conductivities of β-Si₃N₄ filled and β-Si₃N₄/SiO₂ co-filled composites. Furthermore, a common expression of Agari model for co-filled composites and its parameters are given.

Key words: β-Si₃N₄, SiO₂, electric molding composite, thermal conductivity

CLC Number:

TB383

HU Yuan,CHEN Ke-Xin,JIN Hai-Bo,FU Ren-Li. Thermal Conductivity of Electric Molding Composites Filled with β-Si₃N₄[J]. Journal of Inorganic Materials, DOI: 10.3724/SP.J.1077.2007.01201.

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Thermal Conductivity of Electric Molding Composites Filled with β-Si₃N₄

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