[1] Wallace R M. Appl. Surf. Sci., 2004, 231-232: 543--551.  [2] Wilk G D, Wallace R M, Anthony J M. J. Appl. Phys., 2001, 89 (10): 5243--5275.  [3] Garner C M, Kloster G, Atwood G, et al. Microelectronics Reliability, 2005, 45 (5-6): 919--924.  [4] Kim J S, MarZouk H A, Reucroft P J. Thin Solid Films, 1995, 254 (1-2): 33--38.  [5] Chen H W, Landheer D, Wu X, et al. J. Vac. Sci. Technol. A., 2002, 20 (3): 1145--1148.  [6] 阎志军, 王印月, 徐闰, 等. 物理学报, 2004, 53: 2771--2775.  [7] Gao P T, Meng L J, Teixeira V, et al. Vacuum, 2000, 56: 143--148.  [8] 卢红亮, 徐敏, 丁士进, 等(LU Hong-Liang, et al). 无机材料学报(Journal of Inorganic Materials), 2006, 20 (5): 1217--1221.  [9] Wilk G D, Wallace R M. Appl. Phys. Lett., 2000, 76 (1): 112--114.  [10] Quevedo-Lopez M A, El-Bouanani M, Gnade B E, et al. J. Appl. Phys., 2002, 92 (7): 3540--3550.  [11] Wilk G D, Wallace R M. Appl. Phys. Lett., 1999, 74 (19): 2854--2856.  [12] Van Dover R B, Green M L, Manchanda L, et al. Appl. Phys. Lett., 2003, 83 (7): 1459--1461.  [13] Van Dover R B, Lang D V, Green M L, et al. J. Vac. Sci. Technol. A., 2001, 19 (6): 2775--2779.  [14] Kundu M, Miyata N, Ichikawa M. J. Appl. Phys., 2003, 93 (3): 1498--1504.  [15] Gao K Y, Seyller Th, Ley L, et al. Appl. Phys. Lett., 2003, 83 (9): 1830--1832. |