无机材料学报

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β-环氧树脂电子模塑料的导热性能研究

祝渊1, 陈克新1, 金海波2, 傅仁利3   

  1. (1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084; 2. 北京理工大学材料科学与工程学院, 北京 100081; 3. 南京航空航天大学材料科学与技术学院, 南京 210016)
  • 收稿日期:2006-11-13 修回日期:2007-05-15 出版日期:2007-11-20 网络出版日期:2007-11-20

Thermal Conductivity of Electric Molding Composites Filled with β-Si3N4

HU Yuan1, CHEN Ke-Xin1, JIN Hai-Bo2, FU Ren-Li3   

  1. (1. State Key of New Ceramics and Fine Processing, Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China; 2. Discipline of Materials Science & Engineering, Beijing Institute of Technology, Beijing 100081, China; 3. Discipline of Materials Science & Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China)
  • Received:2006-11-13 Revised:2007-05-15 Published:2007-11-20 Online:2007-11-20

摘要: 选用β-Si3N4粉体代替传统的SiO2填料与环氧树脂复合, 制备新型高导热电子模塑料. 初步研究了单独添加β-Si3N4及与SiO2复合添加对复合材料导热性能的影响. 结果表明: β-Si3N4粉体可以显著提高复合材料的导热性能, 当填充率达到50vol%时, β-Si3N4填充复合材料热导为SiO2填充复合材料的约3.8倍. 并在实验基础上, 探讨了复合材料的热导率计算模型, 给出了单一填充和复合填充复合材料的Agari热导率计算模型表达式及相关参数.

关键词: β-Si3N4, 二氧化硅, 电子模塑料, 热导率

Abstract: New electric molding composites were fabricated with hybridizing epoxy and β-Si3N4 instead of silica. The thermal conductivity of composites filled with β-Si3N4 was compared with that co-filled with β-Si3N4 and SiO2. The results demonstrate that the thermal conductivity of the composite increases obviously with the increasing of β-Si3N4 content. Thermal conductivity of β-Si3N4-filled composite is about 3.8 times as large as that of SiO2-filled one when the additional volume fraction achieves to 50%. Based on the experimental results, the discussion of calculating model for predicting thermal conductivity of composites shows that Agari model is more applicable to predict the thermal conductivities of β-Si3N4 filled and β-Si3N4/SiO2 co-filled composites. Furthermore, a common expression of Agari model for co-filled composites and its parameters are given.

Key words: β-Si3N4, SiO2, electric molding composite, thermal conductivity

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