激光诱导玻璃通孔改质的结构演化机理及多维表征研究进展

doi:10.15541/jim20260309

摘要/Abstract

摘要： 玻璃通孔(Through Glass Via, TGV)凭借优异高频电学性能、良好工艺兼容性与低成本集成优势,成为先进封装领域中替代传统硅通孔的关键互连技术之一。激光诱导深刻蚀(Laser-induced deep etching, LIDE)通过激光改质与选择性湿法刻蚀实现高深径比通孔制备,其核心科学问题在于光场能量沉积如何驱动玻璃网络结构演化,以及这些结构变化如何决定后续刻蚀选择性和通孔质量。本研究基于激光与玻璃间相互作用的研究进展,重点综述了玻璃通孔改质结构演化及相应的多维表征方法。首先,分析了高斯光束、激光光丝与贝塞尔光束等光束整形技术在TGV制备中的应用特点,指出贝塞尔光束在长焦深、高一致性通孔加工方面的优势与局限。其次,探讨了激光诱导玻璃改质的物理化学过程,涵盖多光子/隧穿电离、局域热效应及结构改质三个主要阶段,并揭示了改质区域在湿法刻蚀中实现高选择比的动力学机制。同时,总结了从宏观形貌到原子尺度以及光谱学的多维度表征技术,阐明了其在解析改质区域微观结构演化与缺陷形成机制中的关键作用。最后,提出了当前激光诱导玻璃通孔改质机理研究及表征方法上仍面临的局限性与挑战,并展望了该方面研究未来的发展趋势与重点研究方向。

关键词: 玻璃通孔, 先进封装, 激光诱导, 结构演化机理, 多维表征, 综述

Abstract: Through Glass Vias (TGV), with their excellent high-frequency electrical properties, good process compatibility, and low-cost integration advantages, have become one of the key interconnection technologies replacing traditional silicon through-silicon vias in the field of advanced packaging. Laser-induced deep etching (LIDE) achieves the fabrication of high-aspect-ratio vias through laser modification and selective wet etching. Its core scientific problem lies in how optical field energy deposition drives the structural evolution of the glass network, and how these structural changes determine the subsequent etching selectivity and via quality. Based on the research progress of laser-glass interactions, this paper primarily reviews the structural evolution of TGV modification and its multi-dimensional characterization methods. First, the paper analyzes the application features of beam shaping technologies such as Gaussian beams, laser filaments, and Bessel beams in TGV fabrication, highlighting the advantages and limitations of Bessel beams in deep-focus and high-consistency via processing. Secondly, it explores the physicochemical processes of laser-induced glass modification, covering three main stages: multiphoton/tunnel ionization, localized thermal effects, and structural modification, and reveals the kinetic mechanism by which the modified regions achieve a high selectivity ratio during wet etching. At the same time, multi-dimensional characterization techniques ranging from macroscopic morphology to atomic scale and spectroscopy are summarized, clarifying their key role in analyzing the microstructural evolution and defect formation mechanisms in the modified regions. Finally, the paper addresses the current limitations and challenges in research on laser-induced glass via modification mechanisms and characterization methods, and envisions future development trends and key research directions in this field.

Key words: through glass vias, advanced packaging, laser-induced, structural evolution mechanism, multi-dimensional characterization, review

中图分类号:

TN405

赵泽佳, 蔡梓渤, 任永会, 毕文仲, 朱钦塨, 任海深, 刘万超, 林慧兴. 激光诱导玻璃通孔改质的结构演化机理及多维表征研究进展[J]. 无机材料学报, DOI: 10.15541/jim20260309.

ZHAO Zejia, CAI Zibo, REN Yonghui, BI Wenzhong, ZHU Qinggong, REN Haishen, LIU Wanchao, LIN Huixing. Research Progress on Structural Evolution Mechanism and Multi-dimensional Characterization of Laser-induced Modification for Through Glass Vias[J]. Journal of Inorganic Materials, DOI: 10.15541/jim20260309.

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