Journal of Inorganic Materials ›› 2020, Vol. 35 ›› Issue (4): 454-460.DOI: 10.15541/jim20190186

Special Issue: 结构陶瓷论文精选(二)

• RESEARCH PAPER • Previous Articles     Next Articles

Effect of Organic-inorganic Crosslinking Degree on the Mechanical and Thermal Properties of Aerogels

ZHANG Ze,WANG Xiaodong(),SHEN Jun()   

  1. Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China
  • Received:2019-04-29 Revised:2019-07-16 Published:2020-04-20 Online:2019-09-04
  • Contact:
  • Supported by:
    National Key Research and Development Program of China(2017YFA0204600);National Natural Science Foundation of China(11874288)


In all kinds of aerogels, silicon-based aerogel possesses the most comprehensive mechanism of Sol-Gel process and maturest synthesis process. In this work, different types of silicon-based aerogels were prepared via different silicon precursors including tetraethoxysilane (TEOS), methyltrimethoxysilane (MTMS), vinylmethyldimethoxysilane (VMDMS) and the mixed precursor of MTMS and dimethyldimethoxysilane (DMDMS). All samples display high specific surface area and porous microstructure. Effect of the precursor structure on the mechanical and thermal properties of final samples was deeply investigated. The results show that elastic property of silicon-based aerogels depends greatly on the crosslinking degree of their skeleton. The lower the crosslinking degree of the sample is, the better the elastic property is. Furthermore, the elastic property can be further improved by introducing hydrocarbon chains into the skeleton. Thermal conductivity of the obtained aerogels is between 0.032 and 0.041 W/(m·K) at room temperature. Their weight loss increases with the increase of the organic component in the skeleton. Superior mechanical and thermal properties enable silicon-based aerogels to be promising candidates for thermal insulation and energy storage.

Key words: aerogel, skeleton structure, mechanical property, thermal property

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