Journal of Inorganic Materials ›› 2019, Vol. 34 ›› Issue (3): 279-293.DOI: 10.15541/jim20180465
Special Issue: 庆祝上海硅酸盐所独立建所60周年虚拟专刊!; 热电材料与器件; 优秀作者论文集锦; 优秀作者作品欣赏:能源材料
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ZHANG Qi-Hao, BAI Sheng-Qiang, CHEN Li-Dong
Received:
2018-10-08
Revised:
2018-10-29
Published:
2019-03-20
Online:
2018-11-01
Supported by:
CLC Number:
ZHANG Qi-Hao, BAI Sheng-Qiang, CHEN Li-Dong. Technologies and Applications of Thermoelectric Devices: Current Status, Challenges and Prospects[J]. Journal of Inorganic Materials, 2019, 34(3): 279-293.
Fig. 1 Timelines underscoring the improvement in (a) zT value of typical thermoelectric materials[6,7] and (b) conversion efficiency of typical thermoelectric power generation devices[10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,26,27,28,29,30,31,32,33,34,35,36,37,38,39,40]
Fig. 5 (a) Conversion efficiency as a function of thermoelectricelement height for different thermal contact parameter,r,and (b) power output ratio Pc/Pmax as a function of the electrical contact parameter,n, for different thermoelectric element height[46]
Fig. 7 Analogical scheme of the thermoelectric phenomena with the thermal capacitances $C_{n}=\rho ·n·C_{p_{n}}·\frac{H}{N}·A$ and thermal conductances $K_{n}=\frac{k_{n}·A}{H/N}$ [55]
Thermoelectric material | (Th/Tc)/℃ | Electrode | Interface layer | Joining method | Ref. |
---|---|---|---|---|---|
Bismuth telluride | 240/22 | Cu | Ni | Soldering | [59-60] |
Bismuth telluride | - | - | Ni | One-step hot press sintering | [61] |
Bismuth telluride | 200/- | Cu | Ni | Solid-liquid diffusion welding | [62] |
Bismuth telluride | 250/50 | Al | Mo | Plasma spraying | [63] |
Bismuth telluride | 240/20 | Cu | Mo | Arc spraying | [64] |
MgAg0.965Ni0.005Sb0.99 | 245/20 | Ag | - | Diffusion welding | [65] |
Poly[Ax(M-ett)] | 147/67 | Hot side: Al | Au | [66] | |
Cold side: Ag | |||||
n-type PbTe + p-type TAGS 85 | 500/100 | Ag | Ag/Fe/Ag + Fe | Diffusion welding | [25] |
Skutterudite | 500/40 | Al | Mo | Brazing | [67] |
Skutterudite | 550/70 | n-type: CoSi2 | [31] | ||
p-type: Co2Si | |||||
Skutterudite | 600/35 | Hot side: Mo-Cu Cold side: Cu | Ti-Al | Brazing | [17] |
n-type Bi2Te3/PbTe + p-type Sb2Te3/PbTe | 600/10 | Cu | Hot side: Co0.8Fe0.2 | Liquid InGa eutectic alloy | [35] |
Cold side: Ni | |||||
Bismuth telluride/ Skutterudite | 600/35 | Hot side: Mo-Cu | Hot side: Ti-Al | Welding | [40] |
Cold side: Cu | Cold side: Ni | ||||
Half-Heusler | 718/63 | Hot side: Mo-Cu | Brazing | [18] | |
Cold side: Cu | |||||
n-type Fe0.93Co0.07Si1.99Al0.01 + p-type MnSi1.73 | 700/100 | TiSi2 | Welding | [19] | |
SiGealloy | 870/31 | Mo | Pressure contact | Cold side In welding | [68] |
SiGe alloy | 553/44 | Mo | C | Brazing | [69] |
SiGe alloy | 1000/300 | With Ti layer | Diffusion welding | [70] | |
n-type Ca0.92La0.08MnO3 + p-type Ca2.75Gd0.25Co4O9 | 773 /383 | Silver electrode | Silver paste | [71] | |
p-type Mg2Si0.53Sn0.4Ge0.05Bi0.02 + n-type MnSi1.75Ge0.01 | 735/50 | Hot side: Mo | p-type: Ni/Pb/Ni | Spring contact | [37] |
Cold side: Cu | n-type: Cu |
Table 1 Electrode, interface layer and joining method of typical thermoelectric devices
Thermoelectric material | (Th/Tc)/℃ | Electrode | Interface layer | Joining method | Ref. |
---|---|---|---|---|---|
Bismuth telluride | 240/22 | Cu | Ni | Soldering | [59-60] |
Bismuth telluride | - | - | Ni | One-step hot press sintering | [61] |
Bismuth telluride | 200/- | Cu | Ni | Solid-liquid diffusion welding | [62] |
Bismuth telluride | 250/50 | Al | Mo | Plasma spraying | [63] |
Bismuth telluride | 240/20 | Cu | Mo | Arc spraying | [64] |
MgAg0.965Ni0.005Sb0.99 | 245/20 | Ag | - | Diffusion welding | [65] |
Poly[Ax(M-ett)] | 147/67 | Hot side: Al | Au | [66] | |
Cold side: Ag | |||||
n-type PbTe + p-type TAGS 85 | 500/100 | Ag | Ag/Fe/Ag + Fe | Diffusion welding | [25] |
Skutterudite | 500/40 | Al | Mo | Brazing | [67] |
Skutterudite | 550/70 | n-type: CoSi2 | [31] | ||
p-type: Co2Si | |||||
Skutterudite | 600/35 | Hot side: Mo-Cu Cold side: Cu | Ti-Al | Brazing | [17] |
n-type Bi2Te3/PbTe + p-type Sb2Te3/PbTe | 600/10 | Cu | Hot side: Co0.8Fe0.2 | Liquid InGa eutectic alloy | [35] |
Cold side: Ni | |||||
Bismuth telluride/ Skutterudite | 600/35 | Hot side: Mo-Cu | Hot side: Ti-Al | Welding | [40] |
Cold side: Cu | Cold side: Ni | ||||
Half-Heusler | 718/63 | Hot side: Mo-Cu | Brazing | [18] | |
Cold side: Cu | |||||
n-type Fe0.93Co0.07Si1.99Al0.01 + p-type MnSi1.73 | 700/100 | TiSi2 | Welding | [19] | |
SiGealloy | 870/31 | Mo | Pressure contact | Cold side In welding | [68] |
SiGe alloy | 553/44 | Mo | C | Brazing | [69] |
SiGe alloy | 1000/300 | With Ti layer | Diffusion welding | [70] | |
n-type Ca0.92La0.08MnO3 + p-type Ca2.75Gd0.25Co4O9 | 773 /383 | Silver electrode | Silver paste | [71] | |
p-type Mg2Si0.53Sn0.4Ge0.05Bi0.02 + n-type MnSi1.75Ge0.01 | 735/50 | Hot side: Mo | p-type: Ni/Pb/Ni | Spring contact | [37] |
Cold side: Cu | n-type: Cu |
Fig. 10 Scanning electron microscope images of CoSb3/Ti/Mo-Cu interface after thermal aging at 550 ℃ for different periods[115](a) 0; (b) 8 d; (c) 20 d; (d) 30 d
Fig. 11 (a) Schematic diagram of the formation of Ti(100-x)Alx-Yb0.6Co4Sb12 interface, (b) the diffusion layer thickness and (c) specificcontact resistivity of the Ti(100-x)Alx-Yb0.6Co4Sb12 interface as a function of the thermal aging time under 600 ℃ and vacuum condition[79]
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