Journal of Inorganic Materials ›› 2019, Vol. 34 ›› Issue (5): 469-477.DOI: 10.15541/jim20180393
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Zheng-De LIN1,2,Sheng-Cheng SHU1,2,Ao LI1,2,Ming-Liang WU1,Ming-Yang YANG1,2,Yu HAN3,Zhi-Xiang ZHU3,Bao-An CHEN3,Yi DING3,Qiang ZHANG3,Qiang WANG4,Dan DAI1()
Received:
2018-09-03
Revised:
2018-11-22
Published:
2019-05-20
Online:
2019-05-14
Supported by:
CLC Number:
Zheng-De LIN, Sheng-Cheng SHU, Ao LI, Ming-Liang WU, Ming-Yang YANG, Yu HAN, Zhi-Xiang ZHU, Bao-An CHEN, Yi DING, Qiang ZHANG, Qiang WANG, Dan DAI. Preparation and Mechanical Property of Graphene-reinforced Copper Matrix Composites[J]. Journal of Inorganic Materials, 2019, 34(5): 469-477.
Processing technique | Processing route | Merits/Demerits |
---|---|---|
PM | Ball milling (ultrasonication) + Hot pressing | Excellent dispersion, good mechanical bonding/higher defect concentration |
CVD | Ball milling + CVD + Hot pressing | Random distribution, in-situ grown grapheme with perfect quality, excellent interfacial bonding/grain growth, low graphene integrity |
ED | Pulse reverse electrodeposition + Annealing | Smooth, highly dense, uniform dispersion, fine grain size |
MLM | Molecular Level Mixing + SPS | Homogeneous dispersion, low defect density after reduction, strong interactions between Cu and graphene |
ARB | Accumulative roll bonding + Hot compaction | Enhanced interfacial bonding, significant grain refinement/ poor plasticity |
Table 1 Processing cessing routes and merits/demerits of processing techniques
Processing technique | Processing route | Merits/Demerits |
---|---|---|
PM | Ball milling (ultrasonication) + Hot pressing | Excellent dispersion, good mechanical bonding/higher defect concentration |
CVD | Ball milling + CVD + Hot pressing | Random distribution, in-situ grown grapheme with perfect quality, excellent interfacial bonding/grain growth, low graphene integrity |
ED | Pulse reverse electrodeposition + Annealing | Smooth, highly dense, uniform dispersion, fine grain size |
MLM | Molecular Level Mixing + SPS | Homogeneous dispersion, low defect density after reduction, strong interactions between Cu and graphene |
ARB | Accumulative roll bonding + Hot compaction | Enhanced interfacial bonding, significant grain refinement/ poor plasticity |
Researchers | Processing route | Graphene content | Yield strength/MPa | Tensile strength/MPa | Compression strength/MPa | Bending strength/MPa | |
---|---|---|---|---|---|---|---|
vol% | wt% | ||||||
Ponraj, et al[ | PM | - | 0 | - | - | 214 | - |
- | 1 | - | - | 215 | - | ||
- | 2 | - | - | 234 | - | ||
Li, et al[ | PM+HP | 2.5 | - | - | - | - | 441 |
5 | - | - | - | - | 301 | ||
7.5 | - | - | - | - | 284 | ||
10 | - | - | - | - | 211 | ||
Chen, et al[ | CVD+HP | - | 0 | 87 | 228 | - | - |
- | 0.5 | 290 | 308 | - | - | ||
Hwang, et al[ | MLM+SPS | 0 | - | 138 | 230 | - | - |
0.5 | - | 195 | 271 | - | - | ||
1.0 | - | 268 | 320 | - | - | ||
Liu, et al[ | ARB | - | - | - | 496 | - | - |
Table 2 Mechanical properties of graphene-reinforced copper matrix composites
Researchers | Processing route | Graphene content | Yield strength/MPa | Tensile strength/MPa | Compression strength/MPa | Bending strength/MPa | |
---|---|---|---|---|---|---|---|
vol% | wt% | ||||||
Ponraj, et al[ | PM | - | 0 | - | - | 214 | - |
- | 1 | - | - | 215 | - | ||
- | 2 | - | - | 234 | - | ||
Li, et al[ | PM+HP | 2.5 | - | - | - | - | 441 |
5 | - | - | - | - | 301 | ||
7.5 | - | - | - | - | 284 | ||
10 | - | - | - | - | 211 | ||
Chen, et al[ | CVD+HP | - | 0 | 87 | 228 | - | - |
- | 0.5 | 290 | 308 | - | - | ||
Hwang, et al[ | MLM+SPS | 0 | - | 138 | 230 | - | - |
0.5 | - | 195 | 271 | - | - | ||
1.0 | - | 268 | 320 | - | - | ||
Liu, et al[ | ARB | - | - | - | 496 | - | - |
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