Journal of Inorganic Materials ›› 2018, Vol. 33 ›› Issue (4): 421-426.DOI: 10.15541/jim20170203

• Orginal Article • Previous Articles     Next Articles

In situ Pyrolyzed Carbon on the Property of AlN-based Microwave Attenuation Ceramics

HE Yong-Qin, LI Xiao-Yun, ZHANG Jing-Xian, LI Xiao-Guang   

  1. 1. School of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, China;
    2. Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites, Nanjing 210009, China;
    3. Structural Ceramics Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
  • Received:2017-04-28 Revised:2017-06-13 Published:2018-04-30 Online:2018-03-27
  • About author:HE Yong-Qin. E-mail: 15261806381@163.com

Abstract:

Carbon materials exhibit excellent microwave absorbing properties. However, it is difficult to disperse carbon homogeneously in the ceramic substrate. In this study, carbon was introduced into AlN matrix by addition of phenolic resin followed by pyrolysis process. The effects of phenolic resin content on sintering behavior, microstructure, thermal conductivity and dielectric properties of AlN ceramics were investigated. It was found that phenolic resin derived carbon could effectively promote the densification of AlN ceramics and reduce the sintering temperature. Relative density of the AlN ceramics reached 99.26% after sintering at 1700℃ with addition of 3wt% phenolic resin. In addition, it was found that the presence of phenolic resin derived carbon can effectively improve the thermal conductivity of the ceramics. The dielectric properties were also improved due to the carbon films formed in the pores and at AlN grain boundaries. With addition of 6wt% phenolic resin, AlN ceramics showed high thermal conductivity of 135.1 W/(m•K) and excellent microwave attenuation properties (the dielectric loss was 0.3 at X-band), which were perspective candidates for possible applications in high power microwave vacuum electron devices.

 

Key words: phenolic resin, AlN, thermal conductivity, dielectric loss

CLC Number: