梯度复合SiC/C面向等离子体材料的制备与表征

无机材料学报

梯度复合SiC/C面向等离子体材料的制备与表征

武安华^1,2; 曹文斌¹; 葛昌纯¹; 李敬锋^3,4; 川崎亮⁴

1. 北京科技大学特种陶瓷粉末冶金研究室, 北京 100083; 2. 中国科学院上海硅酸盐研究所, 上海 200050; 2. 清华大学材料科学与工程系, 北京 100084; 4. 日本东北大学; 仙台 980-8579

收稿日期:2002-05-31 修回日期:2002-08-19 出版日期:2003-07-20 网络出版日期:2003-07-20

Processing and Characterization of Graded SiC/C Plasma Facing Composite

WU An-Hua^1,2; CAO Wen-Bin¹; GE Chang-Chun¹; LI Jing-Feng^3,4; Kawasaki Akira⁴

1. Laboratory of Special Ceramics and P/M; University of Science and Technology Beijing; Beijing 100083; China; 2. Shanghai Institute of Ceramics; Chinese Academy of Sciences; Shanghai 200050, China; 3. Department of Material Science and Technology; Tsinghua University; Beijing 100084, China; 4. Graduate School of Engineering Tohoku University Sendai; Japan; 980-8579

Received:2002-05-31 Revised:2002-08-19 Published:2003-07-20 Online:2003-07-20

摘要/Abstract

摘要： 利用粉末冶金方法,完成了SiC和C两种难烧结物质的同步烧结,制备出了SiC成分分布从0％～100％的接近理论密度的SiC/C FGM,显微观察显示材料的成分和结构是呈梯度分布的。材料将SiC的良好的耐腐蚀性和石墨的良好的抗热冲击性结合在一起,并具有较高的有效热导和良好的抗热疲劳能力,化学溅射和Tokamak原位等离子体辐照结果显示材料具有良好的耐高温等离子体冲刷性能。

关键词: 功能梯度材料, 面向等离子体材料, 热导

Abstract: Simultaneous sintering of SiC and C was completed with the powder metallurgical method, and with which a near dense
plasma facing material with 0～100% compositional distributions of SiC---bulk SiC/C FGM was obtained. Well graded composition and structure of that composite
were demonstrated by SEM analysis. SiC/C FGM combines the well erosion resistance of SiC and high thermal-shock resistance of graphite, and has the high
effective thermal conductivity and thermal fatigue resistance. Chemical sputtering and Takamok irradiation experiments indicate that SiC/C FGM has
good high temperature plasma erosion resistance.

Key words: FGM, plasma facing material, thermal conductivity

中图分类号:

TB333

武安华,曹文斌,葛昌纯,李敬锋,川崎亮. 梯度复合SiC/C面向等离子体材料的制备与表征[J]. 无机材料学报.

WU An-Hua,CAO Wen-Bin,GE Chang-Chun,LI Jing-Feng,Kawasaki Akira. Processing and Characterization of Graded SiC/C Plasma Facing Composite[J]. Journal of Inorganic Materials.

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