无机材料学报 ›› 2023, Vol. 38 ›› Issue (3): 243-255.DOI: 10.15541/jim20220607
齐占国1(), 刘磊1, 王守志1(), 王国栋1, 俞娇仙2, 王忠新1, 段秀兰1, 徐现刚1, 张雷1()
收稿日期:
2022-10-17
修回日期:
2022-11-20
出版日期:
2023-01-17
网络出版日期:
2023-01-17
通讯作者:
王守志, 研究员. E-mail: wangsz@sdu.edu.cn;作者简介:
齐占国(1999-), 男, 博士研究生. E-mail: zhan_guo_2021@163.com
基金资助:
QI Zhanguo1(), LIU Lei1, WANG Shouzhi1(), WANG Guogong1, YU Jiaoxian2, WANG Zhongxin1, DUAN Xiulan1, XU Xiangang1, ZHANG Lei1()
Received:
2022-10-17
Revised:
2022-11-20
Published:
2023-01-17
Online:
2023-01-17
Contact:
WANG Shouzhi, professor. E-mail: wangsz@sdu.edu.cn;About author:
QI Zhanguo (1999-), male, PhD candidate. E-mail: zhan_guo_2021@163.com
Supported by:
摘要:
相比于第一代和第二代半导体材料, 第三代半导体材料具有更高的击穿场强、电子饱和速率、热导率以及更宽的带隙, 更适用于制备高频、大功率、抗辐射、耐腐蚀的电子器件、光电子器件和发光器件。氮化镓(GaN)作为第三代半导体材料的代表之一, 是制作蓝绿激光、射频微波器件和电力电子器件的理想衬底材料, 在激光显示、5G通信、相控阵雷达、航空航天等领域具有广阔的应用前景。氢化物气相外延(Hydride vapor phase epitaxy, HVPE)方法因生长设备简单、生长条件温和和生长速度快而成为制备GaN晶体的主流方法。由于普遍使用石英反应器, HVPE法生长获得的非故意掺杂GaN不可避免地存在施主型杂质Si和O, 使其表现出n型半导体特性, 但载流子浓度高和导电率低限制了其在高频大功率器件中的应用。掺杂是改善半导体材料电学性能最普遍的方法, 通过掺杂不同掺杂剂可以获得不同类型的GaN单晶衬底, 提高其电化学特性, 从而满足市场应用的不同需求。本文介绍了GaN半导体晶体材料的基本结构和性质, 综述了近年来采用HVPE法生长高质量GaN晶体的主要研究进展; 对GaN的掺杂特性、掺杂剂类型、生长工艺以及掺杂原子对电学性能的影响进行了详细介绍。最后简述了HVPE法生长掺杂GaN单晶面临的挑战和机遇, 并展望了GaN单晶的未来发展前景。
中图分类号:
齐占国, 刘磊, 王守志, 王国栋, 俞娇仙, 王忠新, 段秀兰, 徐现刚, 张雷. GaN单晶的HVPE生长与掺杂进展[J]. 无机材料学报, 2023, 38(3): 243-255.
QI Zhanguo, LIU Lei, WANG Shouzhi, WANG Guogong, YU Jiaoxian, WANG Zhongxin, DUAN Xiulan, XU Xiangang, ZHANG Lei. Progress in GaN Single Crystals: HVPE Growth and Doping[J]. Journal of Inorganic Materials, 2023, 38(3): 243-255.
图1 GaN示意图[4]
Fig. 1 Schematic diagram of GaN[4] (a) Hexagonal unit call (left) and the bond structure of GaN (right), with green balls indicating Ga atoms and blue balls indicating N atoms; (b) Polar face (left), non-polar face (middle) and one kind of semi-polar faces (right) of GaN crystal
图3 HVPE生长的GaN晶体照片及质量表征
Fig. 3 Photos and characterization of GaN crystals grown by HVPE (a) 2-inch 2.5 mm thick GaN crystal; (b) (0002) surface high-resolution XRD pattern; (c) (10¯12) high-resolution XRD pattern; (d) Image of GaN wafers; (e) CL image (dislocation density ~5×106 cm-2); (f) AFM image (RMS<0.2 nm in the range of 10 μm×10 μm)
Type | Impurities | Dopant | Characteristic | Application | Ref. |
---|---|---|---|---|---|
n type | Si | SiCl2H2 | High carrier concentration; anti-surfactant effect | High power and high current optoelectronic devices (LED, LD) | |
Ge | GeCl4/Ge3N4 | Little effect on lattice structure and stress, causing no morphological deterioration, higher carriers concentration than that of Si-doped; creating cavities inside the sample | [ | ||
p type | Mg | Mg(S) | Increased lattice constant and band gap width, high conductivity | Luminescent device | [ |
Semi- insulating | Fe | Fe(S)/Cp2Fe | High resistivity (iron showing a parasitic effect, easy to diffuse) | High power/frequency devices, HEMT, photoconductive switch, detectors | [ |
Mn | Mn(S) | ||||
C | CH4/C2H4/C5H12 |
表1 不同类型掺杂GaN的对比[2-3,32]
Table 1 Different types of doped GaN[2-3,32]
Type | Impurities | Dopant | Characteristic | Application | Ref. |
---|---|---|---|---|---|
n type | Si | SiCl2H2 | High carrier concentration; anti-surfactant effect | High power and high current optoelectronic devices (LED, LD) | |
Ge | GeCl4/Ge3N4 | Little effect on lattice structure and stress, causing no morphological deterioration, higher carriers concentration than that of Si-doped; creating cavities inside the sample | [ | ||
p type | Mg | Mg(S) | Increased lattice constant and band gap width, high conductivity | Luminescent device | [ |
Semi- insulating | Fe | Fe(S)/Cp2Fe | High resistivity (iron showing a parasitic effect, easy to diffuse) | High power/frequency devices, HEMT, photoconductive switch, detectors | [ |
Mn | Mn(S) | ||||
C | CH4/C2H4/C5H12 |
图4 Si掺杂HVPE-GaN[38]
Fig. 4 Si-doped HVPE-GaN[38] (a) Structure of Si-doped HVPE-GaN reactor; (b) Image of 800 μm- thick Si-doped HVPE-GaN; (c) Distribution of free carrier concentration along the diameter of Si-doped HVPE-GaN
图5 Ge掺杂HVPE-GaN[47]
Fig. 5 Ge-doped HVPE-GaN[47] (a) Structure of Ge-doped HVPE-GaN reactor; (b) Morphologies of Ge-doped HVPE-GaN: crystallized in H2 carrier gas (left), crystallized in N2 carrier gas (middle), distribution of free carrier concentration along the diameter of Ge-doped HVPE-GaN
图6 Mg掺杂HVPE-GaN
Fig. 6 Mg-doped HVPE-Ga (a) Schematic of the HVPE system for growth of Mg doped GaN using MgO[53]; (b) Hole concentration measured at room temperature as a function of Mg concentration[55]; (c) Compensating donor concentration (Nd) and acceptor concentration (Na) as a function of Mg concentration[55]
图8 Fe掺杂GaN
Fig. 8 Fe-doped GaN (a) Resistivity as a function of reciprocal temperature for samples doped with Mn, C, and Fe[8]; (b) Formation energy versus Fermi level for FeGa, FeN and Fei in GaN in different charge states, under Ga-rich conditions[68]; (c) Carrier concentration and Hall mobility versus Fe concentration in GaN films co-doped with Si and Fe[70]; (d) Resistivity versus inverse temperature for samples doped with Fe at various Fe concentrations[63]; (e) Schematic diagram of the energy levels and carrier decay processes of Fe-doped GaN[71]; (f) Carrier trapping time for Fe-doped GaN bulk crystals[72]
图9 C掺杂GaN
Fig. 9 C-doped GaN (a) Formation energy versus Fermi level for CGa and CN in GaN: Ga-rich conditions (left), and N-rich conditions (right)[79]; (b) CN impurity model in GaN[79]; (c) Optical transitions of CN in GaN[79]; (d) Defect density as a function of C concentration[81]; (e) Temperature-dependent resistivity for C doped GaN[82] ; (f) Concentrations of carbon, oxygen, and silicon in C-doped GaN layers versus the input mole fraction of pentane[82]
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