Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment

doi:10.15541/jim20180559

Abstract

Abstract:

Aluminum nitrides (AlN), which possess high thermal conductivity, high electrical resistivity, good dimensional stability and excellent mechanical property, have been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials. In this paper, the application potential of ceramics in space electronic systems is discussed. And the basic capabilities of AlN were analyzed. Heat transfer property of AlN and its copper clad laminate were of selective and theoretical analysis, which were further verified by simulation. Finally, the thermal conductive performance of AlN in the simulated space thermal cycle environment was discussed. The results show that the thermal conductivity is up to 174.1 W·m ^-1·K ^-1 and the thermal diffusivity of copper clad laminates is higher than that of pure aluminum nitrides. The simulation results of thermal characteristics are in agreement with the theoretical calculation. The final space environment simulation tests indicate that the thermal conductive capabilities of aluminum nitrides remain extremely stable.

Key words: aerospace, aluminum nitride, copper clad laminate, thermal conductivity, theoretical calculation, simulation

CLC Number:

TQ174

HE Duan-Peng,GAO Hong,ZHANG Jing-Jing,WU Jie,LIU Bo-Tian,WANG Xiang-Ke. Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment[J]. Journal of Inorganic Materials, 2019, 34(9): 947-952.

Figures/Tables 11

Fig. 1 (a) Schematic diagram and (b) physical diagram of aluminum nitrides direct bonded copper

Fig. 2 XRD patterns of AlN ceramics

Fig. 3 (a) Grain morphology of AlN and (b) schematic diagram of the mechanism of the effect of grain boundary on thermal conductivity

Fig. 4 Thermal conductivities of AlN ceramics at different temperatures with insets showing the measured data of specific heat capacity and thermal diffusion

Fig. 5 (a) Photographs and (b) thermal diffusion coefficient of AlN ceramics and copper clad laminate

Fig. 6 3D model of ceramic copper clad laminate

Fig. 7 Equivalent thermal resistance network of modules

Table 1 Thermophysical parameters of components

Materials (Module components)	Thermal conductivity /(W?m^-1?K^-1)	Thickness /mm	Thermal resistance /(℃?W^-1)
Aluminum nitrides direct bonded copper	170	1.235	0.0051
Supporting base (SiC/Al)	180	2.5	0.0136
Solder	60	0.2	0.0033
Shell (alumina)	35	5.0	0.1394

Fig. 8 Simulation diagrams of temperature distribution under (a) normal conditions and (b) after 500 thermal cycle tests

Fig. 9 Effect of space temperature cycle simulation test on (a) thermal diffusivity and (b) conductivity of aluminum nitrides

Fig. 10 Scanning electron microscope photographs of AlN ceramics (a) before and (b) after temperature cycle test

References 11

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