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ISSN:1000-324X CN:31-1363/TQ
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Journal of Inorganic Materials
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中文
Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment
HE Duan-Peng,GAO Hong,ZHANG Jing-Jing,WU Jie,LIU Bo-Tian,WANG Xiang-Ke
Journal of Inorganic Materials . 2019, (
9
): 947 -952 . DOI: 10.15541/jim20180559
