Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F3 as Sintering Aid

Abstract

Abstract: Aluminium nitride ceramics were successfully fabricated through low-temperature sintering by using (YCa)F₃as the sintering aid. AIN ceramics with a high thermal conductivity of 208W/m·K were obtained after the specimen was sintered at 1650℃ for 6h. Calculation based on the present and reported results led to an equation which describes the dependence of thermal conductivity of AIN on the soaking time in sintering: λ(t) =λ_∞ -△λ(0)·e^-t/r. SEM, TEM, SThM and HREM were employed to study, the microstructure-property relationship of AlN ceramics. It was concluded that AlN grain sizes
have little effect on the thermal conductivity, while grain boundary phases deteriorate thermal conductivity.

Key words: aluminium nitride, sintering, thermal conductivity, microstructure, SThM

CLC Number:

TQ174

LIU Yao-Cheng,ZHOU He-Ping,QIAO Liang. Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F₃ as Sintering Aid[J]. Journal of Inorganic Materials.

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Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F₃ as Sintering Aid

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