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无机材料学报

无机材料学报 ›› 2023, Vol. 38 ›› Issue (2): 125-136.DOI: 10.15541/jim20220338 CSTR: 32189.14.10.15541/jim20220338

所属专题： 【信息功能】纪念殷之文先生诞辰105周年虚拟学术专辑

• 综述 • 上一篇    下一篇

冷烧结技术的研究现状及发展趋势

冯静静1(), 章游然1,2, 马名生1, 陆毅青1, 刘志甫1,2()   

  1. 1.中国科学院 上海硅酸盐研究所, 中科院无机功能材料与器件重点实验室, 上海 201899
    2.中国科学院大学 材料科学与光电技术学院, 北京 100049
  • 收稿日期:2022-06-17 修回日期:2022-07-29 出版日期:2023-02-20 网络出版日期:2022-09-15
  • 通讯作者: 刘志甫, 研究员. E-mail: liuzf@mail.sic.ac.cn
  • 作者简介:冯静静(1989-), 女, 博士. E-mail: fengjingjing@mail.sic.ac.cn
  • 基金资助:
    中国博士后科学基金(2021M693264);国家自然科学基金(61871369)

Current Status and Development Trend of Cold Sintering Process

FENG Jingjing1(), ZHANG Youran1,2, MA Mingsheng1, LU Yiqing1, LIU Zhifu1,2()   

  1. 1. Key Laboratory of Inorganic Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
    2. College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China
  • Received:2022-06-17 Revised:2022-07-29 Published:2023-02-20 Online:2022-09-15
  • Contact: LIU Zhifu, professor. E-mail: liuzf@mail.sic.ac.cn
  • About author:FENG Jingjing (1989-), female, PhD. E-mail: fengjingjing@mail.sic.ac.cn
  • Supported by:
    China Postdoctoral Science Foundation(2021M693264);National Natural Science Foundation of China(61871369)

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摘要：

采用常规热烧结实现陶瓷粉体的致密化, 烧结温度通常超过1000 ℃, 这不仅需要消耗大量能源, 还会使一些陶瓷材料在物相稳定性、晶界控制以及与金属电极共烧等方面面临挑战。近年来提出的冷烧结技术(Cold Sintering Process, CSP)可将烧结温度降低至400 ℃以下, 利用液相形式的瞬态溶剂和单轴压力, 通过陶瓷颗粒的溶解-沉淀过程实现陶瓷材料的快速致密化。冷烧结技术具有烧结温度低和时间短等特点, 自开发以来受到广泛关注, 目前已应用于近百种陶瓷及陶瓷基复合材料, 涉及电介质材料、半导体材料、压敏材料和固态电解质材料等。本文介绍了冷烧结技术的发展历程、工艺技术及其致密化机理, 对其在陶瓷材料及陶瓷-聚合物复合材料领域的研究现状进行了综述, 其中根据溶解性的差异主要介绍了Li2MoO4陶瓷、ZnO陶瓷和BaTiO3陶瓷的冷烧结现状。针对冷烧结技术工艺压力高的问题及可能的解决途径进行了探讨, 并对冷烧结技术未来的发展趋势进行了展望。

关键词: 冷烧结技术, 陶瓷, 复合材料, 溶剂, 综述

Abstract:

Densification of ceramic materials by conventional sintering process usually requires a high temperature over 1000 ℃, which not only consumes a lot of energy, but also forces some ceramic materials to face challenges in phase stability, grain boundary control, and co-firing with metal electrodes. In recent years, an extremely low temperature sintering technique named cold sintering process (CSP) was proposed, which can reduce the sintering temperature to below 400 ℃, and realize the rapid densification of ceramic materials through the dissolution- precipitation process of ceramic particles by using the transient solvent in liquid phase and uniaxial pressure. The advantages of CSP, including low sintering temperature and short sintering time, have attracted extensive attention from researchers, since it was firstly reported in 2016. At present, CSP has been applied to the sintering of nearly 100 kinds of ceramics and ceramic-matrix composites, involving dielectric materials, semiconductor materials, pressure-sensitive materials, and solid-state electrolyte materials. This paper firstly introduces the low-temperature sintering techniques’ development history, process and densification mechanism. Then, application of CSP in the field of ceramic materials and ceramic-polymer composites is summarized. Based on differences of solubility, application of CSP mainly on Li2MoO4 ceramics, ZnO ceramics, BaTiO3 ceramics, and their composites preparations are introduced. Auxiliary effect of the transient solvent on cold sintering process is emphatically analyzed. Moreover, the high pressure issue in the cold sintering process and the possible solutions are discussed. At last, future development trend of cold sintering process is prospected.

Key words: cold sintering process, ceramic, composite, solvent, review

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