原位裂解碳对氮化铝基微波衰减陶瓷性能的影响

doi:10.15541/jim20170203

无机材料学报 ›› 2018, Vol. 33 ›› Issue (4): 421-426.DOI: 10.15541/jim20170203

原位裂解碳对氮化铝基微波衰减陶瓷性能的影响

何永钦^1,2, 李晓云¹, 张景贤³, 李晓光³

1. 南京工业大学材料科学与工程学院, 南京 210009;
2. 江苏先进无机功能复合材料协同创新中心, 南京 210009;
3. 中国科学院上海硅酸盐研究所, 结构陶瓷工程研究中心, 上海 200050

收稿日期:2017-04-28 修回日期:2017-06-13 出版日期:2018-04-30 网络出版日期:2018-03-27
作者简介:何永钦(1992-), 男, 硕士研究生. E-mail: 15261806381@163.com

In situ Pyrolyzed Carbon on the Property of AlN-based Microwave Attenuation Ceramics

HE Yong-Qin, LI Xiao-Yun, ZHANG Jing-Xian, LI Xiao-Guang

1. School of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, China;
2. Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites, Nanjing 210009, China;
3. Structural Ceramics Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China

Received:2017-04-28 Revised:2017-06-13 Published:2018-04-30 Online:2018-03-27
About author:HE Yong-Qin. E-mail: 15261806381@163.com

摘要/Abstract

摘要：

碳材料具有优异的吸波性能, 但是难以在陶瓷基体中均匀分散。本研究通过酚醛树脂裂解的方法在氮化铝陶瓷基体中引入碳, 研究了酚醛树脂的添加量对氮化铝陶瓷烧结性能、微观形貌、导热性能和介电性能的影响。研究发现, 酚醛裂解形成的碳能够有效促进氮化铝陶瓷的致密化进程, 降低烧结温度。当酚醛树脂含量为3wt%, 1700℃烧结后陶瓷的致密度达到99.26%。此外, 裂解碳的引入能够显著提高材料的导热性能, 并在材料的气孔中和氮化铝的晶界处形成碳膜, 从而显著提高材料的介电性能。当酚醛树脂含量为6wt%时, 材料热导率达135.1W/(m·K), 在X波段的介电损耗为0.3, 表明材料具有良好的微波衰减能力, 有望应用于大功率的微波电真空器件中。

关键词: 酚醛树脂, 氮化铝, 热导率, 介电损耗

Abstract:

Carbon materials exhibit excellent microwave absorbing properties. However, it is difficult to disperse carbon homogeneously in the ceramic substrate. In this study, carbon was introduced into AlN matrix by addition of phenolic resin followed by pyrolysis process. The effects of phenolic resin content on sintering behavior, microstructure, thermal conductivity and dielectric properties of AlN ceramics were investigated. It was found that phenolic resin derived carbon could effectively promote the densification of AlN ceramics and reduce the sintering temperature. Relative density of the AlN ceramics reached 99.26% after sintering at 1700℃ with addition of 3wt% phenolic resin. In addition, it was found that the presence of phenolic resin derived carbon can effectively improve the thermal conductivity of the ceramics. The dielectric properties were also improved due to the carbon films formed in the pores and at AlN grain boundaries. With addition of 6wt% phenolic resin, AlN ceramics showed high thermal conductivity of 135.1 W/(m•K) and excellent microwave attenuation properties (the dielectric loss was 0.3 at X-band), which were perspective candidates for possible applications in high power microwave vacuum electron devices.

Key words: phenolic resin, AlN, thermal conductivity, dielectric loss

中图分类号:

TQ174

何永钦, 李晓云, 张景贤, 李晓光. 原位裂解碳对氮化铝基微波衰减陶瓷性能的影响[J]. 无机材料学报, 2018, 33(4): 421-426.

HE Yong-Qin, LI Xiao-Yun, ZHANG Jing-Xian, LI Xiao-Guang. In situ Pyrolyzed Carbon on the Property of AlN-based Microwave Attenuation Ceramics[J]. Journal of Inorganic Materials, 2018, 33(4): 421-426.

图/表 7

图1 酚醛树脂的裂解反应过程

Fig. 1 Pyrolysis process of phenolic resin

图2 酚醛树脂含量对不同温度烧结的复相陶瓷相对密度的影响

Fig. 2 Effects of phenolic resin content on the relative densities of composites sintered at different temperatures

图3 1800℃烧结的不同酚醛树脂含量复相陶瓷的XRD 图谱

Fig. 3 XRD patterns of composites with different phenolic resin contents sintered at 1800℃

图4 不同酚醛树脂含量复相陶瓷1800℃烧结后的断面SEM照片及相应的EDS分析

Fig. 4 SEM images and EDS analysis of composites with different phenolic resin content sintered at 1800℃

图5 酚醛树脂含量为6wt%的复相陶瓷的SEM照片(a)及元素分析(b, c)结果

Fig. 5 SEM image (a) and EDS analysis (b, c) of the composite with 6wt% phenolic resin

图6 1800℃烧结的不同酚醛树脂含量复相陶瓷的导热性能

Fig. 6 Thermal properties of composites with different phenolic resin contents sintered at 1800℃

图7 1800℃烧结的不同酚醛树脂含量复相陶瓷的X波段介电性能

Fig. 7 Dielectric properties at X-band of composites with different phenolic resin contents sintered at 1800℃

参考文献 16

[1]	BILJANA MIKIJELJ, DAVID K ABE, RON HUTCHEON.AlN- based lossy ceramics for high average power microwave devices: performance-property correlation.Journal of the European Ceramic Society, 2003, 23(14): 2705-2709.
[2]	SHI MING, LU YAN-PING.Development of AlN-based microwave- absorbing materials.Bulletin of The Chinese Ceramic Society, 2005, 24(6): 76-79.
[3]	SLACK GA, TANZILLI RA, POHL RO,et al. The intrinsic thermal conductivity of AlN. Journal of Physics and Chemistry of Solids, 1987, 48(7): 641-647.
[4]	ZHANG YAN, MA HUI-NA, YANG ZHI-MING,et al. Research on dielectric properties of AlN-Mo composite ceramics. Materials Review, 2008, 22(12): 129-131.
[5]	CHEN GUI-QIAO, LI XIAO-YUN, QIU TAI.Study on performance of AlN-W composites with microwave attenuation characteristics.China Ceramic Industry, 2006, 13(4): 22-25.
[6]	YANG ZHEN-TAO, LU YAN-PING.Study on the preparation and properties of AlN-W microwave attenuation materials by pressureless sintering.Bulletin of The Chinese Ceramic Society, 2013, 32(9): 1741-1750.
[7]	BU WEN-BO, QIU TAI, XU JIE.Preparation and microwave attenuation performance of AlN-SiC composites.Journal of the Chinese Ceramic Society, 2003, 31(9): 828-831.
[8]	SERBENYUK T B, ALEKSANDROVA L I, ZAIKA M I,et al. Structure, mechanical and functional properties of aluminum nitride-silicon carbide ceramic material. Journal of Superhard Materials, 2008, 30(6): 384-391.
[9]	BU WEN-BO, QIU TAI, XU JIE,et al. Study on microwave attenuation characteristics of AlN-C composites. Electronic Components & Materials, 2003, 22(2): 1-3.
[10]	WU HUA-ZHONG, XU QING-YAN, LI XIAO-YUN.Effect of attenuation agents on thermal conductivity of aluminum nitride attenuation ceramics.Ordnance Material Science and Engineering, 2009, 32(4): 35-37.
[11]	LI XIU-QING.Present status of AlN ceramics package.Semiconductor Information, 1999, 36(2): 13-20.
[12]	KIMBERLY A TRICK, TONY E SALIBA.Mechanisms of the pyrolysis of phenolic resin in a carbon/phenolic composite.Carbon, 1995, 33(11): 1509-1515.
[13]	NAKAMATSU T, POMAR F, ISHIZAKI K.The effect of carbon coating of AlN powder on sintering behavior and thermal conductivity.Journal of Materials Science, 1999, 34(7): 1553-1556.
[14]	MIODOWNIK MARK, HOLM ELIZABETH A, HASSOLD GREGORY N.Highly parallel computer simulations of particles pinning: Zener vindicated.Scripta Materialia, 2000, 42(12): 1173-1177.
[15]	SLACK G A.Nonmetallic crystals with high thermal conductivity.Journal of Physics and Chemistry of Solids, 1973, 34(2): 321-335.
[16]	LIU XIAO-FEI, ZHANG LI-TONG, YIN XIAO-WEI,et al. The microstructure of SiCN ceramics and their excellent electromagnetic wave absorbing properties. Ceramics International, 2015, 41(9): 11372-11378.

原位裂解碳对氮化铝基微波衰减陶瓷性能的影响

In situ Pyrolyzed Carbon on the Property of AlN-based Microwave Attenuation Ceramics

RichHTML

PDF (PC)

可视化

被引次数

摘要/Abstract

引用本文

使用本文

图/表 7

参考文献 16

相关文章 15

编辑推荐

Metrics

本文评价

[1]	付师, 杨增朝, 李宏华, 王良, 李江涛. 复合烧结助剂对Si₃N₄陶瓷力学性能和热导率的影响[J]. 无机材料学报, 2022, 37(9): 947-953.
[2]	胡佳军, 王凯, 侯鑫广, 杨婷, 夏鸿雁. 熔盐法合成高导热磷化硼及其热管理性能研究[J]. 无机材料学报, 2022, 37(9): 933-940.
[3]	王鹏将, 康慧君, 杨雄, 刘颖, 程成, 王同敏. 熵调控抑制ZrNiSn基half-Heusler热电材料的晶格热导率[J]. 无机材料学报, 2022, 37(7): 717-723.
[4]	阮景, 杨金山, 闫静怡, 游潇, 王萌萌, 胡建宝, 张翔宇, 丁玉生, 董绍明. 碳化硅纳米线增强多孔碳化硅陶瓷基复合材料的制备[J]. 无机材料学报, 2022, 37(4): 459-466.
[5]	娄许诺, 邓后权, 李爽, 张青堂, 熊文杰, 唐国栋. Ge掺杂MnTe材料的热电输运性能[J]. 无机材料学报, 2022, 37(2): 209-214.
[6]	王为得, 陈寰贝, 李世帅, 姚冬旭, 左开慧, 曾宇平. 以YbH₂-MgO体系为烧结助剂制备高热导率高强度氮化硅陶瓷[J]. 无机材料学报, 2021, 36(9): 959-966.
[7]	张维维, 陆晨, 应国兵, 张建峰, 江莞. AlN表面处理及级配填充对覆铜板绝缘层性能的影响规律与机制研究[J]. 无机材料学报, 2021, 36(8): 847-855.
[8]	桑玮玮, 张红松, 陈华辉, 温斌, 李新春. (Sm_0.2Gd_0.2Dy_0.2Y_0.2Yb_0.2)₃TaO₇高熵陶瓷的制备及热物理性能[J]. 无机材料学报, 2021, 36(4): 405-410.
[9]	牟庭海, 许文涛, 凌军荣, 董天文, 秦梓轩, 周有福. 微波烧结制备ZrO₂-AlN复合陶瓷的微观结构与性能研究[J]. 无机材料学报, 2021, 36(11): 1231-1236.
[10]	邱小小,周细应,傅赟天,孙晓萌,王连军,江莞. Ge_1-_xIn_xTe微观结构对热电性能的影响[J]. 无机材料学报, 2020, 35(8): 916-922.
[11]	周星圆, 柳伟, 张程, 华富强, 张敏, 苏贤礼, 唐新峰. Nb掺杂Mo_1-_xW_xSeTe固溶体的热-电输运性能优化[J]. 无机材料学报, 2020, 35(12): 1373-1379.
[12]	何端鹏,高鸿,张静静,吴杰,刘泊天,王向轲. 氮化铝覆铜板在空间热场下热学性能的模拟仿真及实验验证[J]. 无机材料学报, 2019, 34(9): 947-952.
[13]	马伯乐, 马文, 黄威, 白玉, 贾瑞灵, 董红英. 单相双稀土改性SrZrO₃热障涂层的热物理性能[J]. 无机材料学报, 2019, 34(4): 394-400.
[14]	骆军, 何世洋, 李志立, 李永博, 王风, 张继业. 热电材料高通量实验制备与表征方法[J]. 无机材料学报, 2019, 34(3): 247-259.
[15]	沈家骏, 方腾, 傅铁铮, 忻佳展, 赵新兵, 朱铁军. 热电材料中的晶格热导率[J]. 无机材料学报, 2019, 34(3): 260-268.