无机材料学报

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AlN/聚乙烯复合基板的导热性能

汪雨荻; 周和平; 乔梁; 陈虎; 金海波   

  1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084
  • 收稿日期:1999-11-15 修回日期:1999-12-16 出版日期:2000-12-20 网络出版日期:2000-12-20

Thermal Conductivity of AlN/PE Composite Substrate

WANG Yu-Di; ZHOU He-Ping; QIAO Liang; CHEN Hu; JIN Hai-Bo   

  1. State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China
  • Received:1999-11-15 Revised:1999-12-16 Published:2000-12-20 Online:2000-12-20

摘要: 利用模压法制备 AlN/聚乙烯复合基板。初步研究了 AlN的结晶形态和填加量对复合基板导热性能的影响,并初步探讨了复合材料热导率的计算模型.结果表明:复合基板的热导率随AlN填加量的增大,最初变化很小,而后迅速升高,随后增长速度又逐渐降低.AlN以晶须形态填加,对提高复合材料的热导率最为有利,纤维次之,粉体最差.

关键词: 氮化铝, 复合基板, 热导率

Abstract: AlN/PE composite substrate was made by mould pressing. The influences of AlN percentage and morphology on the thermal conductivity were studied and the model for predicting thermal conductivity was discussed. The results demonstrate that with the increasing of AlN percentage, the thermal conductivity remains the same initially, after that it increases sharply, and then the rate slows down. The AlN whisker increases the thermal conductivity most efficiently, the second is that AlN fiber and AlN powder are of less efficiency.

Key words: aluminum nitride, thermal conductivity, composite substrat

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