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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

碳泡沫导热性能及力学性能研究

田卓, 李克智, 李贺军, 石振海   

  1. 西北工业大学 碳/碳复合材料工程技术研究中心, 西安 710072
  • 收稿日期:2007-12-24 修回日期:2008-03-02 出版日期:2008-11-20 网络出版日期:2008-11-20

Research on Thermal Conduction and Mechanical Properties for Carbon Foam

TIAN Zhuo, LI Ke-Zhi, LI He-Jun, SHI Zhen-Hai   

  1. C/C Composites Technology Research Center, Northwestern Polytechnical University, Xi’an 710072, China
  • Received:2007-12-24 Revised:2008-03-02 Published:2008-11-20 Online:2008-11-20

PDF (PC)

1820

被引次数

13 | 4

摘要： 用微胶囊化得到的空心酚醛树脂微球制备出酚醛泡沫材料, 在Ar气的保护下进行1000℃碳化和2000℃的石墨化处理, 得到所需的泡沫材料. 研究了孔隙率、热处理温度等因素对碳泡沫导热性能的影响. 结果表明: 提高材料内部空心微球的比例可以降低材料的导热性能, 得到低热导率的泡沫材料; 而对于孔隙率接近的泡沫材料, 降低材料内部的孔径可以起到降低材料热导率的作用; 得到了密度为0.50g/cm3, 热导率为1.007W/m·K, 压缩强度为8.82MPa的碳泡沫材料.

关键词: 热导率, 力学性能, 碳泡沫

Abstract: The phenolic resin foam was prepared by using hollow phenolic resin microspher which was made by microcapsule. And under the protection of Ar, the microcapsules were carbonized at 1000℃ and graphited at 2000℃, then the foam was got. Herein the porosity and the effect of heat treatment temperature on carbon foam were investigated. And the results show that the porosity increasement can reduce the thermal conduction of material, and the low thermal conduction foam is obtained by using this method. However, for the materials with approximative porosity, the thermal conduction is decreased by reducing aperture of material. Finally, the foam material is obtained with density of 0.50g/cm3, thermal conduction of 1.007W/m·K and compressive strength of 8.82MPa.

Key words: thermal conduction, mechanical properties, carbon foam

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