无机材料学报

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立体微型器件的微制造技术及其在微机电系统(MEMS)的应用

李敬锋

  

  1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室 北京 100084
  • 收稿日期:2001-11-23 修回日期:2002-01-10 出版日期:2002-07-20 网络出版日期:2002-07-20

Microfabrication Technology of Three-Dimensional Microdevices and Their MEMS Applications

LI Jing-Feng   

  1. State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China
  • Received:2001-11-23 Revised:2002-01-10 Published:2002-07-20 Online:2002-07-20

摘要: 综述了近年来与微型机电系统(MEMS)相关的材料微制造和微加工技术的最新研究进展.重点介绍了如何利用硅晶片作为微型模具来制备压电陶瓷和热电材料的微型柱状阵列结构和反应烧结碳化硅微型转子等微制造技术,并展望了材料微制造技术在研制微型医疗器件和微型移动能源方面的应用前景.

关键词: MEMS, 微制造, 微型器件, 压电, 热电, 碳化硅

Abstract: Recent status of microfabrication technology related to microelectromechanical systems (MEMS) is reviewed with
particular emphasis on the introduction of our newly developed three-dimensional microfabrication process using a micromachined silicon wafer
as a mold. By using the silicon molding processes, piezoelectric microrod arrays, thermoelectric microelement arrays and silicon carbide micro gas
turbine rotors have been successfully fabricated. Their microfabrication processes are described in detail to demonstrate the success of the
combination of silicon micromachining and materials processing techniques. The prospects for materials microfabrication in the fields of miniature
medical apparatus and portable microscale energy sources are given.

Key words: MEMS, microfabrication, microscale materials processing, microdevice, piezoelectric, thermoelectric

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