氮化铝覆铜板在空间热场下热学性能的模拟仿真及实验验证

doi:10.15541/jim20180559

摘要/Abstract

摘要：

氮化铝(AlN)陶瓷具有高导热、高电阻率、良好的尺寸稳定性以及优异的力学性能等特性, 被认为是新一代高性能陶瓷基板和封装的首选材料。本研究探讨了高性能陶瓷在空间电子系统的应用潜力, 对AlN材料的基础性能进行了分析, 重点分析了AlN陶瓷材料及其覆铜板的热传导性能, 从理论上分析了AlN材料及覆铜板的热特性, 并通过仿真模拟对理论值进行了分析验证, 最后探讨了AlN陶瓷覆铜板在空间热循环模拟环境下的热传导性能。结果表明AlN陶瓷的导热系数高达174.1 W·m ^-1·K ^-1, 覆铜板比纯氮化铝陶瓷具有更高的热扩散系数, 而热特性的仿真结果与理论计算一致。最后空间环境模拟试验表明, AlN材料在温度循环环境下的热传导性能非常稳定。

关键词: 空间, 氮化铝, 覆铜板, 热导率, 理论计算, 仿真

Abstract:

Aluminum nitrides (AlN), which possess high thermal conductivity, high electrical resistivity, good dimensional stability and excellent mechanical property, have been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials. In this paper, the application potential of ceramics in space electronic systems is discussed. And the basic capabilities of AlN were analyzed. Heat transfer property of AlN and its copper clad laminate were of selective and theoretical analysis, which were further verified by simulation. Finally, the thermal conductive performance of AlN in the simulated space thermal cycle environment was discussed. The results show that the thermal conductivity is up to 174.1 W·m ^-1·K ^-1 and the thermal diffusivity of copper clad laminates is higher than that of pure aluminum nitrides. The simulation results of thermal characteristics are in agreement with the theoretical calculation. The final space environment simulation tests indicate that the thermal conductive capabilities of aluminum nitrides remain extremely stable.

Key words: aerospace, aluminum nitride, copper clad laminate, thermal conductivity, theoretical calculation, simulation

中图分类号:

TQ174

何端鹏,高鸿,张静静,吴杰,刘泊天,王向轲. 氮化铝覆铜板在空间热场下热学性能的模拟仿真及实验验证[J]. 无机材料学报, 2019, 34(9): 947-952.

HE Duan-Peng,GAO Hong,ZHANG Jing-Jing,WU Jie,LIU Bo-Tian,WANG Xiang-Ke. Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment[J]. Journal of Inorganic Materials, 2019, 34(9): 947-952.

图/表 11

图1 氮化铝陶瓷覆铜板(a)示意图及(b)实物图

Fig. 1 (a) Schematic diagram and (b) physical diagram of aluminum nitrides direct bonded copper

图2 AlN陶瓷的XRD图谱

Fig. 2 XRD patterns of AlN ceramics

图3 (a)AlN的微观晶粒形貌及(b)晶界对导热系数的影响机理示意图

Fig. 3 (a) Grain morphology of AlN and (b) schematic diagram of the mechanism of the effect of grain boundary on thermal conductivity

图4 不同温度下AlN陶瓷的导热系数, 插图为比热容及热扩散的检测数据

Fig. 4 Thermal conductivities of AlN ceramics at different temperatures with insets showing the measured data of specific heat capacity and thermal diffusion

图5 氮化铝陶瓷及其覆铜板的(a)实物照片和(b)热扩散系数

Fig. 5 (a) Photographs and (b) thermal diffusion coefficient of AlN ceramics and copper clad laminate

图6 陶瓷覆铜板三维模型

Fig. 6 3D model of ceramic copper clad laminate

图7 模块的等效热阻网络

Fig. 7 Equivalent thermal resistance network of modules

表1 各部件的热物理参数

Table 1 Thermophysical parameters of components

Materials (Module components)	Thermal conductivity /(W?m^-1?K^-1)	Thickness /mm	Thermal resistance /(℃?W^-1)
Aluminum nitrides direct bonded copper	170	1.235	0.0051
Supporting base (SiC/Al)	180	2.5	0.0136
Solder	60	0.2	0.0033
Shell (alumina)	35	5.0	0.1394

图8 控制器热场分布仿真图

Fig. 8 Simulation diagrams of temperature distribution under (a) normal conditions and (b) after 500 thermal cycle tests

图9 空间温度循环模拟试验对(a)氮化铝陶瓷材料热扩散和(b)热传导性能的影响

Fig. 9 Effect of space temperature cycle simulation test on (a) thermal diffusivity and (b) conductivity of aluminum nitrides

图10 温度循环试验(a)前(b)后AlN陶瓷材料的扫描电镜照片

Fig. 10 Scanning electron microscope photographs of AlN ceramics (a) before and (b) after temperature cycle test

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