Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate

doi:10.15541/jim20170546

Abstract

Abstract:

Thermal Controlled Cracking Method (TCCM) has developed for more than 60 years with great success. The research progress of TCCM in the past 60 years was reviewed in two directions, i.e. Premade Trajectory Cutting (PTC) and Non-Premade Trajectory Cutting (NPTC) respectively. For PTC, cutting velocity, trajectory deviation and sectional quality are the main process parameters to be optimized. For NPTC, cutting velocity and sectional quality are the main process parameters to be optimized. The crucial technique for optimizing these above parameters is to adopt new techniques for generating advanced heating source, cooling source and better process flow. These new techniques are expected to provide enormous promotion for the developing of TCCM.

Key words: thermal controlled cracking, glass, ceramic, research progress

CLC Number:

TQ174

WANG Hai-Long, WANG Yang, WANG Xiang-Wei, ZHANG Hong-Zhi. Research Progress of Thermal Controlled Cracking of Hard-Brittle Plate[J]. Journal of Inorganic Materials, 2018, 33(9): 923-930.

Figures/Tables 14

Fig. 1 Mechanism of non-premade trajectory cutting(NPTC)[20]

Fig. 2 Mechanism of premade trajectory cutting (PTC)[21]

Fig. 3 Cutting velocity-plate width curve[33]

Fig. 4 Trajectory deviation of NPTC[34]

Fig. 5 Double laser beam for cutting with turn[38]

Fig. 6 YAG laser cutting glass based on volumetric heating method[39]

Fig. 7 Glass cut by NPTC with YAG[39](a) Plate; (b) Tube

Fig. 8 Comparison of bending strength of cutting section with multiple cut methods[40]

Fig. 9 Principle diagram of laser induced plasma processing glass[42]

Fig. 10 Equipment for microwave induced cracking(MIC)[43]

Fig. 11 (a) Glass and (b) SiC ceramic plates cut with MIC[43]

Fig. 12 Inner initial fracture induced method and its location[45](a) Method; (b) Location

Fig. 13 Process flow of splitting with PTC[47]

Fig. 14 Cross-sectional views of femtosecond laser scribing followed by CO2 laser heating and rapid cooling[48] (a) After one laser pass; (b) After five laser passes; (c) After six laser passes; (d) Initial crack propagation

References 51

[1]	ZHANG CHONG, YUAN SONG-MEI, AMIN MUHAMMAD,et al. Development of a cutting force prediction model based on brittle fracture for C/SiC in rotary ultrasonic facing milling. International Journal of Advanced Manufacturing Technology, 2016, 85(1-4): 573-583.
[2]	SENER KARABULUT, HENIFI CINICI, HALIL KARAKOC.Experimental investigation and optimization of cutting force and tool wear in milling Al7075 and open-cell SiC foam composite.Arabian Journal for Science & Engineering, 2016, 41(5): 1797-1812.
[3]	ZHAO GUO-LONG, HUANG CHUANZHEN, HE NING,et al. Fabrication and cutting performance of reactively hot-pressed TiB2-TiC-SiC ternary cutting tool in hard turning of AISI H13 steel. International Journal of Advanced Manufacturing Technology, 2017, 91: 943-954.
[4]	YUAN SONG-MEI, FAN HUITAO, AMIN MUHANMMAD,et al. A cutting force prediction dynamic model for side milling of ceramic matrix composites C/SiC based on rotary ultrasonic machining. International Journal of Advanced Manufacturing Technology, 2016, 86(1-4): 37-48.
[5]	SHARMA VIKAS, VINOD KUMAR.Investigating the quality characteristics of Al5052/SiC metal matrix composites machined by CO2 laser curve cutting.Proceedings of the Institution of Mechanical Engineers Part L: Journal of Materials Design & Applications, 2015, 232(1): 3-19.
[6]	SHIN DONGSIG, YONGKWON CHO, HYONKEE SOHN.Towards optimized efficiency of ablation in copper using a 515 nm picosecond laser process.Journal of Laser Micro, 2015, 10(3): 241-244.
[7]	YASUHISA SANO, KOHEI AIDA, TAKEHIRO KATO, ,et al. Cutting of SiC wafer by atmospheric-pressure plasma etching with wire electrode. Materials Science Forum, 2012, 717-720: 865-868.
[8]	SAVRUN E, TAYA M.Surface characterization of SiC whisker/2124 aluminium and Al2O3, composites machined by abrasive water jet.Journal of Materials Science, 1988, 23(4): 1453-1458.
[9]	SON HYEON-TAEK, KIM DAE-GUEN, PARK SOON-SUB,et al. Spark plasma sintering and ultra-precision machining characteristics of SiC. Korean Journal of Materials Research, 2010, 20(11): 559-569.
[10]	PRASHANTHA S, VEERESHA R B, SHASHIDHARA S M,et al. A study on machining characteristics of Al6061-SiC metal matrix composite through wire-cut electro discharge machining. Materials Today Proceedings, 2017, 4(10): 10779-10785.
[11]	ZHOU WEIGUO, GONG KEYU, WAN JIE,et al. Molecular dynamics simulation study on ablation of silicon by water-jet-guided laser. Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering, 2017, 231(6): 1217-1225.
[12]	DANIEL LAROUCHE, JOSEPH LANGLAIS, WU WEI-LI,et al. A constitutive model for the tensile deformation of a binary aluminum alloy at high fractions of solid. Metallurgical & Materials Transactions B, 2006, 37(3): 431-443.
[13]	SUYITNO, KOOL W H, KATGERMAN L. Integrated approach for prediction of hot tearing.Metallurgical & Materials Transactions A, 2009, 40(10): 2388-2400.
[14]	RACHID MHAMDIA, SERIER B, AIBEDAH A,et al. Numerical analysis of the influences of thermal stresses on the efficiency of bonded composite repair of cracked metallic panels. Journal of Composite Materials, 2017, 51(26): 3701-3709.
[15]	BILČÍK J, SONNENSCHEIN R, GAŽOVIČOVÁ N. Causes of early-age thermal cracking of concrete foundation slabs and their reinforcement to control the cracking.Slovak Journal of Civil Engineering, 2017, 25(3): 8-14.
[16]	CHU DONG-YANG, LI XIANG, LIU ZHANLI.Study the dynamic crack path in brittle material under thermal shock loading by phase field modeling.International Journal of Fracture, 2017, 330: 1-16.
[17]	GRAHAM C E, LUMLEY R M, OBERHOLZER D J.Laser Substrate Parting: US, US3629545. 1971.
[18]	KARLSSON M N A, DEPPERT K, WACASER B A,et al. Size-controlled nanoparticles by thermal cracking of iron pentacarbonyl. Applied Physics A, 2005, 80(7): 1579-1583.
[19]	FRIEDL D I.Method for Laser Thermal Separation of Ceramic or Other Brittle Flat Materials: EP, EP1990168. 2012.06.27.
[20]	UEDA T, YAMADA K, OISO K,et al. Thermal stress cleaving of brittle materials by laser beam. CIRP Annals - Manufacturing Technology, 2002, 51(1): 149-152.
[21]	TSAI CHWAN-HUEI, HUANG BO-WEN.Diamond scribing and laser breaking for LCD glass substrates.Journal of Materials Processing Technology, 2008, 198(1/2/3): 350-358.
[22]	SHEPELOV G V, SHIGANOV I N.Cutting sheet glass with the beam of a solid-state laser.Welding International, 2000, 14(12): 988-991.
[23]	KONDRATENKO VLADIMIR S.Method of Splitting Non-metallic Materials: US, US 5609284 A. 1997.
[24]	YAMAMOTO KOJI, HASAKA NOBORU, MORITA HIDEKI,et al. Thermal stress analysis on laser scribing of glass. Journal of Laser Applications, 2008, 20(4): 193-200.
[25]	YAMAMOTO KOJI, HASAKA NOBORU, MORITA HIDEKI,et al. Three-dimensional thermal stress analysis on laser scribing of glass. Precision Engineering, 2008, 32(4): 301-308.
[26]	YAMAMOTO KOJI, HASAKA NOBORU, MORITA HIDEKI,et al. Partial growth of crack in laser scribing of glass. Journal of Laser Applications, 2009, 21(2): 917-923.
[27]	YAMAMOTO KOJI, HASAKA NOBORU, MORITA HIDEKI,et al. Influence of thermal expansion coefficient in laser scribing of glass. Precision Engineering, 2010, 34(1): 70-75.
[28]	YAMAMOTO KOJI, HASAKA NOBORU, MORITA HIDEKI,et al. Influence of glass substrate thickness in laser scribing of glass. Precision Engineering, 2010, 34(1): 55-61.
[29]	YAHATA KEISUKE, YAMAMOTO KOJI, ETSUJI OHMURA.Crack propagation analysis in laser scribing of glass (machine elements, design and manufacturing).Journal of Laser Micro, 2010, 5(2): 109-114.
[30]	ABRAMOV ANATOLI A, Black MATTHEW L, GLAESEMANN G SCOTT.Laser separation of chemically strengthened glass.Physics Procedia, 2010, 5: 285-290.
[31]	ABRAMOV ANATOLI A, SUN YA-WEI, XU WEI, et al. Laser Scoring of Glass Sheets at High Speeds and With Low Residual Stress: US, US8011207. 2011.
[32]	NORIO KARUBE, HIROSHI MIURA.Full-body Laser Scribing Method of Fragile Material: US, US20070062921. 2007.
[33]	KOJIRO KARUBE, NORIO KARUBE.Laser-induced cleavage of LCD glass as full-body cutting.Proceedings of SPIE, 2008, 6880: 1-10.
[34]	SALMAN NISAR, SHEIKH M A, LI LIN,et al. Effect of thermal stresses on chip-free diode laser cutting of glass. Optics & Laser Technology, 2009, 41(3): 318-327.
[35]	SALMAN NISAR, KHAN SOHAIB Z, ALI MUHAMMAD,et al. Comparison of cut path deviation between CO2, and diode lasers in float-glass cutting. Journal of Russian Laser Research, 2014, 35(2): 182-192.
[36]	SALMAN NISAR, SHEIKH M A, LI LIN,et al. The effect of laser beam geometry on cut path deviation in diode laser chip-free cutting of glass. Journal of Manufacturing Science & Engineering, 2010, 132(1): 165-174.
[37]	SALMAN NISAR, LI LIN, ALI MUHAMMAD,et al. The effect of continuous and pulsed beam modes on cut path deviation in diode laser cutting of glass. International Journal of Advanced Manufacturing Technology, 2010, 49(1-4): 167-175.
[38]	MIYASHITA YUKIO, MASASHI MOGI, HIROTAKA HASEGAWA,et al. Study on a controlling method for crack nucleation and propagation behavior in laser cutting of glass. Journal of Solid Mechanics and Materials Engineering, 2008, 2(12): 1555-1566.
[39]	CAI NA, YANG LI-JUN, WANG YANG, ,et al. Experimental research of YAG laser cutting soda-lime glass sheets with controlled fracture. Key Engineering Materials, 2010, 431-432: 507-510.
[40]	SILVIO GEORGI.Separating and structuring of brittle material by the use of laser radiation. Proceedings of SPIE, 2003, 5063: 426-431.
[41]	SHALUPAEV S V, SHERSHNEV E B, NIKITYUK YU V,et al. Two-beam laser thermal cleavage of brittle nonmetallic materials. Journal of Optics Technology, 2006, 73(5): 356-359.
[42]	CHOI WON-SEOK, KIM JONG-HYEONG, KIM JOOHAN.Thermal cleavage on glass by a laser-induced plume.Optics & Lasers in Engineering, 2014, 53(2): 60-68.
[43]	WANG HAI-LONG, ZHANG HONG-ZHI, WANG-YANG.Splitting of glass and SiC ceramic sheets using controlled fracture technique with elliptic microwave spot.Ceramics International, 2017, 43(2): 1669-1676.
[44]	HANG KYOUNG-SHIK, HONG SOON-KUG,OH SEOK-CHANG,et al. A study of cutting glass by laser. Proceedings of SPIE, 2002, 4426: 367-370.
[45]	HUANG KUO-CHENG, WU WEN-HONG, TSENG SHIH-FENG,et al. The mixed processing models development of thermal fracture and laser ablation on glass substrate. International Conference on Advances in Materials and Processing Technologies, 2010, 1: 1612-1617.
[46]	HUANG KUO-CHENG, HSIAO WEN-TSE, HWANG CHI-HUNG,et al. The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms. Optics & Lasers in Engineering, 2015, 67: 31-35.
[47]	SU CHAO-TON, HSIAO YU-HSIANG, CHANG CHIA-CHIN.Parameter optimization design for touch panel laser cutting process.IEEE Transactions on Automation Science and Engineering, 2012, 9(2): 320-329.
[48]	KIM KWANG-RYUL, KIM JAE-HOON, FARSON DAVE F,et al. Hybrid laser cutting for flat panel display glass. Japanese Journal of Applied Physics, 2008, 47(8): 6978-6981.
[49]	TSAI CHWAN-HUEI, CHANG WEI-HAN.Pulsed laser breaking technique for glass substrates.Proceedings of SPIE, 2009, 7204: 1-9.
[50]	WANG XU-HUANG, YAO JIAN-HUA, ZHOU GUO-BIN,et al. Research of the technology of laser cutting LCD glass substrates based on thermal cracking method. Laser Technology, 2011, 35(4): 472-476.
[51]	WANG XU-HUANG, YAO JIAN-HUA, ZHOU GUO-BIN,et al. Numerical simulation and experiment of laser cuttingLiquid crystal display glass substrates . Chinese Journal of Lasers, 2011, 38(6): 1-5.