Journal of Inorganic Materials

• Research Paper • Previous Articles     Next Articles

Directwrite Assembly of Ceramic Threedimensional Structures Based on Photosensitive Inks

SUN Jing-Bo1, LI Bo2, HUANG Xue-Guang1, CAI Kun-Peng2, ZHOU Ji1, LI Long-Tu1   

  1. (1. State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China; 2. Research Institute for Advanced Materials, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China )
  • Received:2009-03-05 Revised:2009-04-14 Published:2009-11-20 Online:2010-04-22

Abstract: A novel kind of photosensitive ceramic inks was developed for DirectWrite Assembly and a BaTiO3 based woodpile structure with filament diameter of about 300μm was fabricated through this method. The preparation of the photosensitive inks, the principle of the Direct Ink Write (DIW) and the sintering schedule were investigated. The analyses at different states in the process show that the BaTiO3 particles keep monodisperse before sintering, which ensures a feasible extrusion of the ink. Moreover, the sintered products exhibit a fine ceramic forming result and isotropic contraction, with little deformation and few cracks. As a powerful molding technique, the DIW has merits of rapicl processing and good compatibility with various materials.

Key words: directwrite, ceramic, ultraviolet curing

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