Journal of Inorganic Materials ›› 2018, Vol. 33 ›› Issue (10): 1089-1096.DOI: 10.15541/jim20180004

• RESEARCH PAPER • Previous Articles     Next Articles

Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior

CHENG Dan1, HUANG Bin1, CHEN Tao1, JING Feng-Juan1, XIE Dong2, LENG Yong-Xiang1, HUANG Nan1   

  1. 1.Key Laboratory for Advanced Technologies of Materials, Ministry of Education, School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, China;2. School of Physics Science and Technology, Southwest Jiaotong University, Chengdu 610031, China
  • Received:2018-01-02 Revised:2018-01-31 Published:2018-10-20 Online:2018-09-25
  • About author:CHENG Dan. E-mail:
  • Supported by:
    National Natural Science Foundation of China (31300787, 31270020, U1330113)


TiCuO films with different microstructures and Cu contents were prepared on Si and 316L SS substrates using DC magnetron sputtering. The microstructure and chemical composition of the films were analyzed by X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS). Corrosion behavior and Cu ions release properties of the films were evaluated by electrochemical corrosion and simulated body-fluid immersion tests, respectively. Endothelial cell (EC) viability on the films was evaluated by CCK-8 assay in vitro. Un-doped TiO2 films exhibit rutile phases. After Cu incorporation, the TiCuO films consist of nano-crystalline grains of Cu2O on their amorphous matrix. The films with higher Cu contents are more susceptible to corrosion and release more Cu ions. The Cu-rich phases of the films result in corrosion. EC viability is enhanced by a certain concentration of Cu ions released from TiCuO films. All above results demonstrated that microstructures and Cu contents of TiCuO films play an important role in controlling copper ions release behaviors, and therefore affect the EC viability.


Key words: TiCuO films, magnetron sputtering, Cu ions release, ECs viability

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