具有气凝胶结构特征的C/SiO2和C/SiC复合材料研究进展

doi:10.15541/jim20160380

摘要/Abstract

摘要：

具有气凝胶结构特征的C/SiO₂和C/SiC复合材料因其多样的结构存在形式和多孔、轻质、耐高温等特性, 在高温隔热、吸附、催化、储氢、光电等多种领域具有广泛的应用前景和研究价值。依据硅源与碳源的不同引入方式, 本文综述了采用共聚法、浸入法和聚合物先驱体热解法制备的具有气凝胶结构特征的C/SiO₂和C/SiC复合材料的研究现状。借助碳材料与SiO₂两者间的相对存在形式, 探讨了这三种工艺方法制备C/SiO₂和C/SiC复合材料的工艺特点, 分析了材料所呈现的组织结构特征、合成机理和性能特点, 并对其潜在的应用前景进行了展望。硅与碳之间多样的复合方式使C/SiO₂和C/SiC复合材料呈现出多样的材料特征和特性, 为相关研究开辟了新的方向。

关键词: C/SiO2复合材料, C/SiC复合材料, 气凝胶, 溶胶-凝胶法, 制备, 综述

Abstract:

C/SiO₂ and C/SiC composites featuring the structures of aerogels possess diverse structural characteristics. Due to their unique properties, such as porosity, low density and high temperature resistance, C/SiO₂ and C/SiC composites can be widely applied in the fields including high temperature thermal insulation, absorption, catalysis, hydrogen storage, and photoelectricity. In this paper, an overview of the literature is presented on C/SiO₂ and C/SiC composites featuring aerogel structures. According to the introducing methods of silicon and carbon sources, these composites can usually be synthesized by three methods: co-polymerization, impregnation and polymeric precursor pyrolysis. The technological characteristics of the three methods are discussed in accordance with relative existence between carbon and silica. Meanwhile, the characteristics of microstructures, crosslinking mechanisms and the physical properties are analyzed. Some researchful proposals for further developments are proposed. In our opinions, the diverse methods of compositing carbon and silicon result in various characteristics and properties of C/SiO₂ and C/SiC composites, which expands relevant research fields.

Key words: carbon-silica composites, carbon-silicon carbide composites, aerogels, Sol-Gel method, preparation, review

中图分类号:

何飞, 李亚, 骆金, 方旻翰, 赫晓东. 具有气凝胶结构特征的C/SiO₂和C/SiC复合材料研究进展[J]. 无机材料学报, 2017, 32(5): 449-458.

HE Fei, LI Ya, LUO Jin, FANG Min-Han, HE Xiao-Dong. Development of SiO₂/C and SiC/C Composites Featuring Aerogel Structures[J]. Journal of Inorganic Materials, 2017, 32(5): 449-458.

图/表 7

参考文献 66

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Precursors	Temperature/ ℃	Density/ (g•cm^-3)	Ratio of porosity/ %	specific surface area/(m²•g^-1)	Pore volume/ (cm³•g^-1)	Average pore size/nm
PhTMS+TMOS (molar ratio=1:4)^[42]	as-prepared 1000	0.48 0.58	-	987 581	-	2.8 2.5
TEOS+PDMS^[51]	1200	0.30	-	198.04	0.684	5.6
MDMS+TEOS (molar ratio=1:1)^[46]	as-prepared 800	-	-	425.5 275.0	1.87 -	17.59 -
BTEE^[52]	as-prepared 1000	-	-	1022 69	0.53 0.02	-
BTME^[52]	as-prepared 1000	-	-	867 735	0.74 0.36	-
TEOS+TBOT+PDMS^[53]	as-prepared 400 600 800 1000	-	-	1.1 300.1 515.2 283.1 1.4	1.7 2.8 2.7 1.7 1.1	-
BTEBP^[13]	300 1300 1400 1500	0.264 0.260 0.265 0.266	83 91 91 91	1190 1050 818 796	0.916 0.802 0.703 0.639	-
MTMS+GPYMS^[54]	as-prepared 1000 as-prepared 1000	0.31 0.61 0.18 0.49	78 - 87 -	464 207 618 150	1.24 0.98 1.07 0.52	11 18 7 14
PHMS^[55]	as-prepared 1000	-	-	227 180	1.37 1.09	52 24
MTES^[56]	as-prepared 1000	-	-	727 168	1.47 0.80	8.0 18.5
PDMS+TrEOS^[57]	as-prepared 1100	-	59-69 1.6	405-583 109	-	3.2-5.0 <2
MDES+TrEOS^[58]	as-prepared 1000	-		88±2 50±1	0.45±0.02 0.31±0.02	-

Precursors	Temperature/ ℃	Density/ (g•cm^-3)	Ratio of porosity/ %	specific surface area/(m²•g^-1)	Pore volume/ (cm³•g^-1)	Average pore size/nm
PhTMS+TMOS (molar ratio=1:4)^[42]	as-prepared 1000	0.48 0.58	-	987 581	-	2.8 2.5
TEOS+PDMS^[51]	1200	0.30	-	198.04	0.684	5.6
MDMS+TEOS (molar ratio=1:1)^[46]	as-prepared 800	-	-	425.5 275.0	1.87 -	17.59 -
BTEE^[52]	as-prepared 1000	-	-	1022 69	0.53 0.02	-
BTME^[52]	as-prepared 1000	-	-	867 735	0.74 0.36	-
TEOS+TBOT+PDMS^[53]	as-prepared 400 600 800 1000	-	-	1.1 300.1 515.2 283.1 1.4	1.7 2.8 2.7 1.7 1.1	-
BTEBP^[13]	300 1300 1400 1500	0.264 0.260 0.265 0.266	83 91 91 91	1190 1050 818 796	0.916 0.802 0.703 0.639	-
MTMS+GPYMS^[54]	as-prepared 1000 as-prepared 1000	0.31 0.61 0.18 0.49	78 - 87 -	464 207 618 150	1.24 0.98 1.07 0.52	11 18 7 14
PHMS^[55]	as-prepared 1000	-	-	227 180	1.37 1.09	52 24
MTES^[56]	as-prepared 1000	-	-	727 168	1.47 0.80	8.0 18.5
PDMS+TrEOS^[57]	as-prepared 1100	-	59-69 1.6	405-583 109	-	3.2-5.0 <2
MDES+TrEOS^[58]	as-prepared 1000	-		88±2 50±1	0.45±0.02 0.31±0.02	-

Property	Value	Comments	Values for vitreous silica
Density/(g•cm^-3)	2.35		2.20
Coefficient of the thermal expansion/K^-1	3.14×10^-6	Average of many samples on cooling between 1000℃ and 100℃; hot-pressed	0.5
Vickers hardness/(kg•mm^-2)	855 704	200 g load 1000 g load	600-700
Critical stress intensity factor /(MPa•m^1/2)	1.8	1000 g load	1
Fracture strength/MPa	153±20	3-point bending of 0.74 mm diameter fibers
Fracture strength/MPa	385±227	3-point bending of bars
Young's elastic modulus/GPa	97.9		70
Index of refraction	1.58	At 0.5893 μm	1.46
Glass transition/℃	1350	Viscosity of 10¹³ P	1190
Dielectric constant	4.4	25℃, 10 to 10⁷ Hz pyrolyzed to 1100℃	4
Dielectric loss tangent	0.1	25℃, 10 to 10⁷Hz pyrolyzed to 1100℃	10^-4
Electrical conductivity /(Ω·cm)^-1	4×10^-13	25℃, pyrolyzed to 1100℃	~10^-22

Property	Value	Comments	Values for vitreous silica
Density/(g•cm^-3)	2.35		2.20
Coefficient of the thermal expansion/K^-1	3.14×10^-6	Average of many samples on cooling between 1000℃ and 100℃; hot-pressed	0.5
Vickers hardness/(kg•mm^-2)	855 704	200 g load 1000 g load	600-700
Critical stress intensity factor /(MPa•m^1/2)	1.8	1000 g load	1
Fracture strength/MPa	153±20	3-point bending of 0.74 mm diameter fibers
Fracture strength/MPa	385±227	3-point bending of bars
Young's elastic modulus/GPa	97.9		70
Index of refraction	1.58	At 0.5893 μm	1.46
Glass transition/℃	1350	Viscosity of 10¹³ P	1190
Dielectric constant	4.4	25℃, 10 to 10⁷ Hz pyrolyzed to 1100℃	4
Dielectric loss tangent	0.1	25℃, 10 to 10⁷Hz pyrolyzed to 1100℃	10^-4
Electrical conductivity /(Ω·cm)^-1	4×10^-13	25℃, pyrolyzed to 1100℃	~10^-22

具有气凝胶结构特征的C/SiO₂和C/SiC复合材料研究进展

Development of SiO₂/C and SiC/C Composites Featuring Aerogel Structures

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