无机材料学报 ›› 2014, Vol. 29 ›› Issue (2): 215-219.DOI: 10.3724/SP.J.1077.2013.13385 CSTR: 32189.14.SP.J.1077.2013.13385

• 研究快报 • 上一篇    下一篇

铜对双靶共溅制备热电薄膜输运性能的影响

曹丽莉,王 瑶,邓 元,罗炳威,祝 薇,史永明, 林 桢   

  1. (特种功能材料与薄膜北京市重点实验室, 北京航空航天大学 材料学院,北京 100191)
  • 收稿日期:2013-08-05 修回日期:2013-09-16 出版日期:2014-02-20 网络出版日期:2014-01-17
  • 作者简介:曹丽莉. E-mail: youyidiyi_04caihua@163.com
  • 基金资助:

    National Natural Science Foundation of China(50772005, 51002006); National High Technology Research and Development Program of China(2009AA03Z322); Fundamental Research Funds for the Central Universities and Key Laboratory of Photochemical Conversion and Optoelectronic Materials, TIPC, CAS

Influence of Cu on Transport Properties of Thermoelectric Thin Film Fabricated via Magnetron Co-sputtering Method

CAO Li-Li, WANG Yao, DENG Yuan, LUO Bing-Wei, ZHU Wei, SHI Yong-Ming,LIN Zhen   

  1. (Beijing Key Laboratory of Special Functional Materials and Films, School of Material Science and Engineering, Beihang University, Beijing 100191, China)
  • Received:2013-08-05 Revised:2013-09-16 Published:2014-02-20 Online:2014-01-17
  • About author:CAO Li-Li(1986-), female, candidate of PhD. E-mail: youyidiyi_04caihua@163.com
  • Supported by:

    National Natural Science Foundation of China(50772005, 51002006); National High Technology Research and Development Program of China(2009AA03Z322); Fundamental Research Funds for the Central Universities and Key Laboratory of Photochemical Conversion and Optoelectronic Materials, TIPC, CAS

摘要: 采用双靶共溅法制备了铜掺杂的碲化铋锑热电薄膜,铜与碲化铋锑共溅的方法有利于形成沿c轴方向择优生长的碲化铋锑薄膜。结果表明,铜原子均匀的掺杂在碲化铋锑薄膜材料中。由于铜原子有利于提高载流子迁移率,薄膜材料的电导率随着铜掺杂比例的提高得到了极大的提升。当铜靶的溅射功率为20 W时,可以得到最高的电导率(15 × 104 S/m),同时功率因子的最佳值可提升到20 μW/(cm?K2)。

关键词: 半导体, 薄膜, 热电性能, 磁控溅射

Abstract: A simple magnetron co-sputtering method was used to fabricate Cu dispersed Bi0.5Sb1.5Te3 thin films, and the co-sputtering method was beneficial to the preferential growth of Bi0.5Sb1.5Te3 thin films along c-axis. Cu atoms were well-dispersed in the nano-structured materials. The electrical conductivity sharply increased with the increasing content of Cu due to the effect of Cu on transport property. For Cu target sputtering power of 20 W, a maximum power factor of 20 μW/(cm?K2) with an electrical conductivity of 15 × 104 S/m at 355 K were achieved.

Key words: semiconductors, thin films, thermoelectric properties, magnetron sputtering

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