无机材料学报 ›› 2024, Vol. 39 ›› Issue (3): 233-258.DOI: 10.15541/jim20230386 CSTR: 32189.14.10.15541/jim20230386
• 综述 • 下一篇
收稿日期:
2023-08-28
修回日期:
2023-09-29
出版日期:
2024-03-20
网络出版日期:
2023-11-28
通讯作者:
李西军, 研究员. E-mail: lixijun@westlake.edu.cn作者简介:
鲍可(1984-), 女, 博士. E-mail: baoke@westlake.edu.cn
基金资助:
Received:
2023-08-28
Revised:
2023-09-29
Published:
2024-03-20
Online:
2023-11-28
Contact:
LI Xijun, professor. E-mail: lixijun@westlake.edu.cnAbout author:
BAO Ke (1984-), female, PhD. E-mail: baoke@westlake.edu.cn
Supported by:
摘要:
热致变色智能窗是通过在玻璃上沉积温度刺激响应型材料, 实现根据环境温度调控窗户玻璃的太阳光透过率, 减少建筑物能耗的节能窗户。二氧化钒(VO2)是一种典型的热致相变材料, 在~68 ℃发生金属-绝缘体相变, 相变前后伴随光学性能的显著变化, 在智能窗等多个领域有潜在的技术应用。然而, 当前VO2基热致变色智能窗的应用仍存在着相变温度(τc)偏高、可见光透过率(Tlum)低和太阳能调节效率(ΔTsol)不足等问题, 无法满足实际建筑节能的需求。为了解决这些问题, 研究人员开展了广泛而深入的工作。化学气相沉积法(Chemical vapor deposition, CVD)能够以合理的成本生产高质量、大面积的VO2薄膜, 受到研究者青睐。本文总结了近年来利用CVD技术制备VO2薄膜的研究进展, 系统介绍常压化学气相沉积、气溶胶辅助化学气相沉积、低压化学气相沉积、金属有机物化学气相沉积、原子层沉积和等离子体增强化学气相沉积等CVD工艺, 分析了反应物种类及比例、反应温度、压力、载体流量等因素对VO2薄膜质量的影响, 并结合元素掺杂、纳米复合薄膜、多层膜结构等对VO2薄膜的性能调控与优化进行总结, 最后对未来等离子体增强化学气相沉积制备VO2薄膜的研究前景做出展望。
中图分类号:
鲍可, 李西军. 化学气相沉积法制备智能窗用热致变色VO2薄膜的研究进展[J]. 无机材料学报, 2024, 39(3): 233-258.
BAO Ke, LI Xijun. Chemical Vapor Deposition of Vanadium Dioxide for Thermochromic Smart Window Applications[J]. Journal of Inorganic Materials, 2024, 39(3): 233-258.
图2 VO2的晶体结构和能带结构
Fig. 2 Schematics of the crystal structures and band structures of VO2 (a, b) Schematic depictions of the crystal structures of the high- temperature tetragonal rutile R phase (a) and low-temperature monoclinic M phase (b)[13]; (c, d) Schematic of the VO2 band structure in the metallic (c) and insulating (d) states[14]
图3 辐射冷却调节智能窗的结构与工作原理[27]
Fig. 3 Structure and concept of an RCRT window[27] (a) Schematic structure of the RCRT window; (b, c) Working principle of RCRT window in summer (b) and winter (c)
V valence | Compound/Molecular formula | Vapor pressure | Ref. |
---|---|---|---|
+3 | V(acac)3/V(C5H7O2)3 | Not volatile, sublimes@220 ℃ | [ |
+3 | V(amd)3/C24H51N6V | 6.6 Pa@70 ℃, 2.6 Pa@120 ℃ | [ |
+4 | TDMAV/C8H24N4V | 133 Pa@64 ℃ | [ |
+4 | TEMAV/C12H32N4V | 13 Pa@25 ℃, 57 Pa@82 ℃, 133 Pa@107 ℃ | [ |
+4 | VCl4 | 780 Pa@20 ℃, 13.3 kPa@100 ℃ | [ |
+4 | VO(acac)2/VO(C5H7O2)2 | 0.21 Pa@96 ℃ | [ |
+4 | VO(thd)2/VO(C11H19O2)2 | 0.27 Pa@96 ℃ | [ |
+4 | VO(hfa)2/VO(C5H2F6O2)2 | 0.18 Pa@57 ℃ | [ |
+5 | VO(OC3H7)3 | 6 Pa@20 ℃, 38.6 Pa@45 ℃, 268 Pa@82 ℃ | [[ |
+5 | VOCl3 | 1.84 kPa@20 ℃, 9.3 kPa@55 ℃ | [ |
表1 CVD制备VO2薄膜采用的钒前驱体的蒸气压
Table 1 Vapor pressure of the vanadium precursorscompounds used for the CVD of VO2 thin films
V valence | Compound/Molecular formula | Vapor pressure | Ref. |
---|---|---|---|
+3 | V(acac)3/V(C5H7O2)3 | Not volatile, sublimes@220 ℃ | [ |
+3 | V(amd)3/C24H51N6V | 6.6 Pa@70 ℃, 2.6 Pa@120 ℃ | [ |
+4 | TDMAV/C8H24N4V | 133 Pa@64 ℃ | [ |
+4 | TEMAV/C12H32N4V | 13 Pa@25 ℃, 57 Pa@82 ℃, 133 Pa@107 ℃ | [ |
+4 | VCl4 | 780 Pa@20 ℃, 13.3 kPa@100 ℃ | [ |
+4 | VO(acac)2/VO(C5H7O2)2 | 0.21 Pa@96 ℃ | [ |
+4 | VO(thd)2/VO(C11H19O2)2 | 0.27 Pa@96 ℃ | [ |
+4 | VO(hfa)2/VO(C5H2F6O2)2 | 0.18 Pa@57 ℃ | [ |
+5 | VO(OC3H7)3 | 6 Pa@20 ℃, 38.6 Pa@45 ℃, 268 Pa@82 ℃ | [[ |
+5 | VOCl3 | 1.84 kPa@20 ℃, 9.3 kPa@55 ℃ | [ |
图7 APCVD以不同VCl4和H2O比例在450 ℃制备的氧化钒薄膜[90]
Fig. 7 Vanadium oxide thin films grown by APCVD at 450 ℃ using different gas precursor ratios[90] (a) XRD patterns for the samples grown using VCl4: H2O ratios of 1 : 1, 1 : 2 and 1 : 3; (b-d) SEM images of as-deposited (b) V2O3, (c) VO2 and (d) V2O5 thin films
图8 VO(acac)2和不同氧化剂通过APCVD反应生成的VO2薄膜的SEM照片(沉积温度500 ℃)[96]
Fig. 8 FE-SEM images of VO2 films obtained via APCVD with VO(acac)2 and different oxygen sources at 500 ℃[96] VO2 obtained using (a) ethanol; (b) propanol; (c) O2 gas
Vanadium precursor | Bubbler temperature/℃ | Oxygen source | Precursor ratio | Substrate temperature/℃ | Carrier gas flow (N2)/ (L·min-1) | *τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VCl4 | 100 | H2O | 1 : 10 | 350-550 | 0.2 | 68 | [ |
VCl4 | 80 | H2O | (0.43-1.08) : 1 | 350-450 | 12 | - | [ |
VCl4 | 80 | C4H8O2 | 2 : 1 | 550 | 23.2 | 68 | [ |
VOCl3 | 90 | H2O | 1.0 : 3.4 | 350-650 | 1.0 | 67 | [ |
VO(acac)2 | 200 | O2 | - | 500-575 | 0.4 | 51.5 | [ |
VO(OC3H7)3 | 50 | - | - | 450 | 3-4 | 65.5 | [ |
表2 APCVD制备VO2薄膜的工艺条件
Table 2 Range of conditions for the vanadium oxide thin films prepared by APCVD
Vanadium precursor | Bubbler temperature/℃ | Oxygen source | Precursor ratio | Substrate temperature/℃ | Carrier gas flow (N2)/ (L·min-1) | *τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VCl4 | 100 | H2O | 1 : 10 | 350-550 | 0.2 | 68 | [ |
VCl4 | 80 | H2O | (0.43-1.08) : 1 | 350-450 | 12 | - | [ |
VCl4 | 80 | C4H8O2 | 2 : 1 | 550 | 23.2 | 68 | [ |
VOCl3 | 90 | H2O | 1.0 : 3.4 | 350-650 | 1.0 | 67 | [ |
VO(acac)2 | 200 | O2 | - | 500-575 | 0.4 | 51.5 | [ |
VO(OC3H7)3 | 50 | - | - | 450 | 3-4 | 65.5 | [ |
图11 通过AACVD在400~750 ℃下以不同VO(acac)2溶液制备的VO2薄膜以及基底[9]
Fig. 11 Substrates and VO2 films deposition via AACVD at 400-750 ℃ using different solutions of VO(acac)2[9] (a, c) Photographs (a) and XRD patterns (c) of VO2 films from methanol solution of VO(acac)2; (b, d) Photographs (b) and XRD patterns (d) of VO2 films from water solution of VO(acac)2
图12 通过AACVD以VO(acac)2水溶液为前驱体在650 ℃制得的VO2薄膜的SEM照片[9]
Fig. 12 SEM images of the VO2 films deposited via AACVD at 650 ℃ using a water solution of VO(acac)2[9] (a) Surface SEM image of the VO2 films at low magnification; (b) Surface SEM image of the VO2 films at high magnification; (c) Cross-sectional SEM image of the VO2 films
图14 LPCVD以V(acac)3为前驱体在不同时间下制得的VO2薄膜(350 ℃下沉积30~120 min, 并在350 ℃下退火2 h)[103]
Fig. 14 VO2 films deposited via LPCVD from V(acac)3 at 350 ℃ for 30-120 min and then annealed at 350 ℃ for 2 h[103] (a) Raman spectra of VO2 films; (d) XRD patterns of VO2 films; (b, c, e, f) SEM photographs of VO2 films deposited for (b) 30, (c) 60, (e) 90, and (f) 120 min, respectively
Vanadium precursor | Evaporator temperature/℃ | Reactor pressure/Pa | Substrate temperature/℃ | O2 flow | Carrier gas flow (Ar) | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VO(acac)2 | 150-175 | 2000 | 475-520 | 20-60 sccm | 50-100 sccm | 66-72 | [ |
VO(acac)2/methanol | 150 | 101325 | 375-450 | 0.02-0.08 L/min | 0.98 L/min | 60 | [ |
VO(acac)2 | 120-150 | 266.6 | 390-490 | Flow rate of O2 to Ar 0.2 | - | 62±1 | [ |
VO(acac)2 | 170 | 399.9 | 200-750 | 150 sccm | 150 sccm | - | [ |
VO(acac)2 | 185 | 2559.36 | 520-550 | 50 sccm | 100 sccm | 61.0-68.5 | [ |
VO(hfa)2/H2O | 100-120 | 350 | 390-600 | - | 3.6-5.0 L/h | 60 | [ |
表3 MOCVD制备VO2薄膜的工艺条件
Table 3 Conditions for VO2 thin films deposited by MOCVD
Vanadium precursor | Evaporator temperature/℃ | Reactor pressure/Pa | Substrate temperature/℃ | O2 flow | Carrier gas flow (Ar) | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VO(acac)2 | 150-175 | 2000 | 475-520 | 20-60 sccm | 50-100 sccm | 66-72 | [ |
VO(acac)2/methanol | 150 | 101325 | 375-450 | 0.02-0.08 L/min | 0.98 L/min | 60 | [ |
VO(acac)2 | 120-150 | 266.6 | 390-490 | Flow rate of O2 to Ar 0.2 | - | 62±1 | [ |
VO(acac)2 | 170 | 399.9 | 200-750 | 150 sccm | 150 sccm | - | [ |
VO(acac)2 | 185 | 2559.36 | 520-550 | 50 sccm | 100 sccm | 61.0-68.5 | [ |
VO(hfa)2/H2O | 100-120 | 350 | 390-600 | - | 3.6-5.0 L/h | 60 | [ |
图16 MOCVD以VO(acac)2为前驱体在200~350 ℃制备的VO2薄膜的SEM照片[106]
Fig. 16 SEM morphologies of VO2 films prepared with MOCVD using VO(acac)2 in the range of 200-350 ℃[106] (a) 200 ℃; (b) 300 ℃; (c) 350 ℃
图17 MOCVD以VO(hfa)2/H2O为反应物制备VO2薄膜[110-111]
Fig. 17 Experimental details of VO2 film deposition based on MOCVD using reaction between VO(hfa)2 and H2O vapors[110-111] (a) Scheme of the MOCVD apparatus; (b) Scheme of pyrohydrolysis of VO(hfa)2 molecules resulting in the VO2 film growth
图18 MOCVD以VO(hfa)2/H2O为反应物制备的VO2薄膜及退火后的SEM照片[111]
Fig. 18 SEM images of VO2 films deposited by MOCVD using VO(hfa)2/H2O[111] (a) As-deposited VO2 film at 390 ℃; (b, c) VO2 films after annealed at (b) 575 and (c) 600 ℃ for 60 min
图19 ALD反应流程图[113]
Fig. 19 Schematic of ALD cycle[113] (a) Precursor A reacts with the substrate; (b) Excess precursor A and reaction byproducts are purged from the chamber; (c) Precursor B is pulsed into the chamber and reacts with the surface; (d) Excess precursor B and reaction products are purged from the chamber
Vanadium precursor | Evaporator temperature/℃ | Oxidant | Substrate temperature/℃ | Annealing conditions | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|
VO(acac)2 | 150 | O2 | 400-475 | - | 66-70 | [ |
VO(acac)2 | - | O2 | 400-450 | 550-850 ℃ for 3 min | - | [ |
VO(OC3H7)3 | RT | H2O | 60-90 | Ar plasma-annealing at 550 ℃ in vacuum | 68 | [ |
TEMAV | 105 | O3 | 150 | 450 ℃ in He/O2 | 68 | [ |
TEMAV | 105 | O3 | 150 | 2 h at 585 ℃ in 1.333×10-3 Pa O2 | 68 | [ |
TEMAV | 105 | H2O | 150 | 450 ℃ in O2/Ar (13.33 Pa) | 70.1 | [ |
TDMAV | RT | H2O/O3 | 50-200 | 550-800 ℃ in N2 for 2 h | - | [ |
TDMAV | 60 | H2O | 150-200 | 475 ℃ in Ar for 100 min | 72 | [ |
VCl4 | - | H2O | 350 | ≥500 ℃ in 90% N2/10% H2 for 60 min | 68 | [ |
表4 ALD制备VO2薄膜的工艺条件
Table 4 Summary of the ALD parameters used for the growth of VOx thin films
Vanadium precursor | Evaporator temperature/℃ | Oxidant | Substrate temperature/℃ | Annealing conditions | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|
VO(acac)2 | 150 | O2 | 400-475 | - | 66-70 | [ |
VO(acac)2 | - | O2 | 400-450 | 550-850 ℃ for 3 min | - | [ |
VO(OC3H7)3 | RT | H2O | 60-90 | Ar plasma-annealing at 550 ℃ in vacuum | 68 | [ |
TEMAV | 105 | O3 | 150 | 450 ℃ in He/O2 | 68 | [ |
TEMAV | 105 | O3 | 150 | 2 h at 585 ℃ in 1.333×10-3 Pa O2 | 68 | [ |
TEMAV | 105 | H2O | 150 | 450 ℃ in O2/Ar (13.33 Pa) | 70.1 | [ |
TDMAV | RT | H2O/O3 | 50-200 | 550-800 ℃ in N2 for 2 h | - | [ |
TDMAV | 60 | H2O | 150-200 | 475 ℃ in Ar for 100 min | 72 | [ |
VCl4 | - | H2O | 350 | ≥500 ℃ in 90% N2/10% H2 for 60 min | 68 | [ |
图21 ALD以TEMAV/O3为反应物制得的氧化钒薄膜(衬底为c-Al2O3)的XPS图谱[123]
Fig. 21 XPS spectra of ALD VO2 films using TEMAV/O3 as reactants on c-Al2O3[123] (a) XPS spectra of as-deposited (black) and annealed (red) VO2 films; (b) Raman spectra of as-deposited (black) and annealed (red) VO2 films
图23 单脉冲和多脉冲两种模式的ALD方法制备VO2薄膜[80]
Fig. 23 Schematic of SP and MP modes employed in the ALD process[80] (a) Typical sequence of the SP and MP modes of the ALD process; (b) Resistivity as a function of temperature and its derivative for the annealed VO2 thickness indicating the transition temperatures during heating and cooling cycle for depositions in SP and MP modes
图24 ALD以TDMAV/H2O为反应物在50 ℃下制备的VOx薄膜[119]
Fig. 24 ALD VOx films deposited with TDMAV/H2O at 50 ℃[119] (a) XRD patterns of VOx film before and after 2 h annealing at 800 ℃ under N2; (b) SEM images of as-deposited and annealed VOx films
图25 ALD以TDMAV/H2O为反应物在150~200 ℃制备的VOx薄膜(在475 ℃氩气中退火100 min)[124]
Fig. 25 ALD VO2 films deposited from TDMAV/H2O at 150-200 ℃ and annealed at 475 ℃ for 100 min in Ar[124] (a-c) AFM images of VO2 films deposited at (a) 150, (b) 175 and (c) 200 ℃; (d) V2p XPS spectrum for the annealed VO2 film deposited at 200 ℃
图26 ALD以VCl4/H2O为反应物制得的VO2薄膜(在500和550 ℃退火)[125]
Fig. 26 ALD VO2 films deposited from VCl4/H2O and subsequently annealed at 500 and 550 ℃[125] (a) Raman spectra of as-deposited sample (black) and annealed samples at 500 (blue) and 550 ℃ (red); (b) XRD patterns of as-deposited and annealed VO2 films
图29 WxV1-xO2d 晶体结构示意图[158]
Fig. 29 Crystalline structures of the WxV1-xO2[158] (a) Crystal structure relationship diagram of R and M1 phases; (b) Schematic diagram of local rutile structure around W dopant
Vanadium precursor | Oxygen source | Dopant precursor | CVD process | Substrate/ temperature/℃ | Doping level/% (in atomic) | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VOCl3 | H2O | WCl6 | APCVD | Glass/500-650 ℃ | 1.9 | 29 | [ |
VCl4 | H2O | W(OC2H5)6 | APCVD | Glass/500-600 ℃ | 0.3 | 50 | [ |
VCl4 | H2O | WCl6 | APCVD | Glass/550 ℃ | 0.12-1.75 | 55.0-5.5 | [ |
VO(acac)2 | 2O2/98N2 | WCl6 | APCVD | Glass/525 ℃ | 0.5 | 55 | [ |
VO(acac)2 | O2 | W(OC2H5)5 | MOCVD | Glass/450 ℃ | 2 | 35 | [ |
VO(acac)2 | - | W(OC2H5)5 | AACVD | Glass/550 ℃ | 0.175-1.98 | 47-28 | [ |
TEMAV | O2 | W(CO)6 | ALD | Si/200 ℃ | 1.63 | 32 | [ |
表5 CVD方法制备W掺杂VO2薄膜的工艺条件
Table 5 Summary of the CVD conditions for the synthesis of W-doped VO2 thin films
Vanadium precursor | Oxygen source | Dopant precursor | CVD process | Substrate/ temperature/℃ | Doping level/% (in atomic) | τc of VO2/℃ | Ref. |
---|---|---|---|---|---|---|---|
VOCl3 | H2O | WCl6 | APCVD | Glass/500-650 ℃ | 1.9 | 29 | [ |
VCl4 | H2O | W(OC2H5)6 | APCVD | Glass/500-600 ℃ | 0.3 | 50 | [ |
VCl4 | H2O | WCl6 | APCVD | Glass/550 ℃ | 0.12-1.75 | 55.0-5.5 | [ |
VO(acac)2 | 2O2/98N2 | WCl6 | APCVD | Glass/525 ℃ | 0.5 | 55 | [ |
VO(acac)2 | O2 | W(OC2H5)5 | MOCVD | Glass/450 ℃ | 2 | 35 | [ |
VO(acac)2 | - | W(OC2H5)5 | AACVD | Glass/550 ℃ | 0.175-1.98 | 47-28 | [ |
TEMAV | O2 | W(CO)6 | ALD | Si/200 ℃ | 1.63 | 32 | [ |
Dopant (s), (in atom) | τc | ΔTsol | Tlum/% | Ref. |
---|---|---|---|---|
W6+/0.6% | ~21.6 ℃/% | 11.4% | 50.8 | [ |
Mo6+ | ~5 ℃/% | - | - | [ |
Nb5+/10% | 52.2 ℃ | - | - | [ |
Ta5+/4% | 24.8 ℃ | 6.8% | 47.1 | [ |
Zr4+/9.8% | 64.3 ℃ | 14.1% | 60.4 | [ |
Mg2+/7% | ~3 ℃/% | 4.8% | 51 | [ |
Co2+/10% | 44 ℃ | 3% | 79 | [ |
Tb3+/2% | 65 ℃ | 8.3% | 54 | [ |
La3+/4% | ~1.1 ℃/% | 10.3 | 50.1 | [ |
Eu3+/4% | ~6.5 ℃/% | 6.7% | 54 | [ |
Si4+/3% | 63.1 ℃ | 13.9% | 54.7 | [ |
Fe3+/Mg2+ | 38.2 ℃ | 12.8% | 42.1 | [ |
Mg2+/W6+ | 35 ℃ | 4.3% | 81.3 | [ |
Tb3+/W6+ | 40.8 ℃ | 6.3% | 40 | [ |
Zr3+/W6+ | 28.6 ℃ | 4.9% | 48.6 | [ |
表6 部分掺杂元素对氧化钒薄膜热致变色性能的影响
Table 6 Effect of dopants on the thermochromic performance of VO2 thin films
Dopant (s), (in atom) | τc | ΔTsol | Tlum/% | Ref. |
---|---|---|---|---|
W6+/0.6% | ~21.6 ℃/% | 11.4% | 50.8 | [ |
Mo6+ | ~5 ℃/% | - | - | [ |
Nb5+/10% | 52.2 ℃ | - | - | [ |
Ta5+/4% | 24.8 ℃ | 6.8% | 47.1 | [ |
Zr4+/9.8% | 64.3 ℃ | 14.1% | 60.4 | [ |
Mg2+/7% | ~3 ℃/% | 4.8% | 51 | [ |
Co2+/10% | 44 ℃ | 3% | 79 | [ |
Tb3+/2% | 65 ℃ | 8.3% | 54 | [ |
La3+/4% | ~1.1 ℃/% | 10.3 | 50.1 | [ |
Eu3+/4% | ~6.5 ℃/% | 6.7% | 54 | [ |
Si4+/3% | 63.1 ℃ | 13.9% | 54.7 | [ |
Fe3+/Mg2+ | 38.2 ℃ | 12.8% | 42.1 | [ |
Mg2+/W6+ | 35 ℃ | 4.3% | 81.3 | [ |
Tb3+/W6+ | 40.8 ℃ | 6.3% | 40 | [ |
Zr3+/W6+ | 28.6 ℃ | 4.9% | 48.6 | [ |
图30 APCVD以VOCl3/TTIP/H2O为反应物在650 ℃下得到VO2/TiO2复合薄膜表征[183]
Fig. 30 Characterization of VO2/TiO2 film formed by the APCVD reaction of VOCl3/TTIP/H2O at 650 ℃[183] (a) XRD pattern; (b) Raman spectrum; (c) SEM image; (d) Variable temperature transmission plot at 2.5 μm
图31 组合APCVD制备VO2/TiO2复合薄膜[184]
Fig. 31 Combinatorial APCVD for the synthesis of VO2/TiO2 composite film[184] (a) Schematic of the APCVD apparatus; (b) Picture of the entire graded VO2/TiO2 composite film formed
图33 APCVD制备的单层和双层薄膜的SEM照片[193]
Fig. 33 SEM images of the monolayer and multilayer samples prepared by APCVD[193] (a) VO2 film; (b) TiO2 film; (c) Multilayer of TiO2 over VO2; (d) Multilayer of VO2 over TiO2
Layer | Precursor | Bubbler temperature /℃ | N2 flow rate /(L·min-1) | Thickness /nm |
---|---|---|---|---|
VO2 | VCl4/C4H8O4 | 80/40 | 0.7/0.2 | ~300 |
SiO2 | SiC8H20O4/C4H8O4 | 130/40 | 0.7/0.2 | ~1300 |
TiO2 | TiCl4/C4H8O4 | 75/40 | 0.6/0.6 | ~100 |
表7 APCVD制备VO2/SiO2/TiO2三层薄膜的工艺参数[195]
Table 7 APCVD conditions of the VO2/SiO2/TiO2 films[195]
Layer | Precursor | Bubbler temperature /℃ | N2 flow rate /(L·min-1) | Thickness /nm |
---|---|---|---|---|
VO2 | VCl4/C4H8O4 | 80/40 | 0.7/0.2 | ~300 |
SiO2 | SiC8H20O4/C4H8O4 | 130/40 | 0.7/0.2 | ~1300 |
TiO2 | TiCl4/C4H8O4 | 75/40 | 0.6/0.6 | ~100 |
图34 APCVD制备的VO2/SiO2/TiO2三层薄膜的SEM照片[195]
Fig. 34 SEM images of multi-layered VO2/SiO2/TiO2 films using APCVD[195] (a) Typical VO2 coating on glass; (b) Porous structure of the SiO2 interlayer, as deposited on VO2 coating; (c) Typical surface morphology of the TiO2 layer in the VO2/SiO2/TiO2 system; (d) Side-on SEM image of VO2/SiO2/TiO2 film
图35 VO2薄膜和SiO2/VO2双层薄膜的SEM和AFM照片[196]
Fig. 35 SEM and AFM images of VO2 and SiO2/VO2 thin films[196] (a, b) SEM and (c) AFM images of the pristine VO2 thin film; (d, e) SEM and (f) AFM images of SiO2/VO2 thin film
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