Journal of Inorganic Materials ›› 2019, Vol. 34 ›› Issue (9): 947-952.DOI: 10.15541/jim20180559

• RESEARCH PAPER • Previous Articles     Next Articles

Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment

HE Duan-Peng1,GAO Hong1(),ZHANG Jing-Jing1,WU Jie2,LIU Bo-Tian1,WANG Xiang-Ke1   

  1. 1.Material Reliability Center, China Academy of Space Technology, Beijing 100094, China
    2.Shandong Institute of Space Electronic Technology, Yantai 264670, China
  • Received:2018-11-29 Revised:2019-01-22 Published:2019-09-20 Online:2019-05-29
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  • Supported by:
    Independent Research and Development of China Aerospace Components Engineering Center(ZY-WZB-2018-05)

Abstract:

Aluminum nitrides (AlN), which possess high thermal conductivity, high electrical resistivity, good dimensional stability and excellent mechanical property, have been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials. In this paper, the application potential of ceramics in space electronic systems is discussed. And the basic capabilities of AlN were analyzed. Heat transfer property of AlN and its copper clad laminate were of selective and theoretical analysis, which were further verified by simulation. Finally, the thermal conductive performance of AlN in the simulated space thermal cycle environment was discussed. The results show that the thermal conductivity is up to 174.1 W·m -1·K -1 and the thermal diffusivity of copper clad laminates is higher than that of pure aluminum nitrides. The simulation results of thermal characteristics are in agreement with the theoretical calculation. The final space environment simulation tests indicate that the thermal conductive capabilities of aluminum nitrides remain extremely stable.

Key words: aerospace, aluminum nitride, copper clad laminate, thermal conductivity, theoretical calculation, simulation

CLC Number: