Journal of Inorganic Materials ›› 2013, Vol. 28 ›› Issue (2): 201-206.DOI: 10.3724/SP.J.1077.2013.12203
• Orginal Article • Previous Articles Next Articles
YU Fang-Li1,2, BAI YU2, QIN Yi2, YUE Dong2, LUO Cai-Jun2, YANG Jian-Feng2
Received:
2012-04-03
Revised:
2012-05-30
Published:
2013-02-10
Online:
2013-01-23
About author:
YU Fang-Li. E-mail: yufangli0405@163.com
Supported by:
CLC Number:
YU Fang-Li, BAI YU, QIN Yi, YUE Dong, LUO Cai-Jun, YANG Jian-Feng. Influence of Substrate Temperature on the Morphology, Composition and Growth Rate of SiC Films Deposited by PECVD[J]. Journal of Inorganic Materials, 2013, 28(2): 201-206.
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Raw materials | Description |
---|---|
SiH4 | Purity, 99.999%, Diluted to10% by H2 |
CH4 | Purity, 99.999% |
H2 | Purity, 99.999% |
Ar | Purity, 99.99% |
Si(100) wafer | P-type doping semiconductor |
Cu wafer | Rolling state, Thickness, 0.1 mm |
Table 1 Raw materials used in the experiment
Raw materials | Description |
---|---|
SiH4 | Purity, 99.999%, Diluted to10% by H2 |
CH4 | Purity, 99.999% |
H2 | Purity, 99.999% |
Ar | Purity, 99.99% |
Si(100) wafer | P-type doping semiconductor |
Cu wafer | Rolling state, Thickness, 0.1 mm |
SiH4 flow rate /sccm | CH4 flow rate /sccm | H2 flow rate /sccm | Substrate temperature /℃ | RF /(W·cm-2) | Pressure /Pa |
---|---|---|---|---|---|
20 | 20 | 130 | 60-500 | 1.3 | 100 |
Table 2 Deposition parameters of thin films
SiH4 flow rate /sccm | CH4 flow rate /sccm | H2 flow rate /sccm | Substrate temperature /℃ | RF /(W·cm-2) | Pressure /Pa |
---|---|---|---|---|---|
20 | 20 | 130 | 60-500 | 1.3 | 100 |
Substrate | Etching solution | Etching time /s |
---|---|---|
Si (100) | Mixed solution of HF and HNO3 (5:1) | 30-35 |
Cu | 50 vol% HNO3 | 150-180 |
Table 3 The etching solution and time of different substrate
Substrate | Etching solution | Etching time /s |
---|---|---|
Si (100) | Mixed solution of HF and HNO3 (5:1) | 30-35 |
Cu | 50 vol% HNO3 | 150-180 |
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