无机材料学报

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微波烧结CuTi-金刚石复合体

程宇航; 吴一平; 陈建国; 朱文玄; 乔学亮; 范瑛+; 潘小霞+   

  1. 华中理工大学材料科学与工程学院; 武汉 430074; +中国工程物理研究院总体工程研究所 绵阳 610003
  • 收稿日期:1998-08-10 修回日期:1998-09-05 出版日期:1999-06-20 网络出版日期:1999-06-20

Microwave Sintering CuTi-Diamond Composite

CHENG Yu-Hang; WU Yi-Ping; CHEN Jian-Guo; ZHU Wen-Xuan; QIAO Xue-Liang; FAN Ying+; PAN Xiao-Xia+   

  1. College of Materials Science and Bngineering; Huazhong University of Science and Technology Wuhan 430074 China; +Institute of Systems Engineering; China Academy of Engineering Physics Mianyang 610003 China
  • Received:1998-08-10 Revised:1998-09-05 Published:1999-06-20 Online:1999-06-20

摘要: 采用微波烧结方法制备出CuTi-金刚石复合体,并对复合体的工艺、组织和结构进行了研究.结果表明,金刚石颗粒在烧结过程中没有发生石墨化转变,CuTi-金刚石复合体中金刚石颗粒与CuTi基体间能形成良好的结合.CuTi-金刚石复合体的致密度随金刚石含量的增加出现先增加后降低的变化趋势,当金刚石含量为18.75~25vol%时达到最大值.

关键词: 微波烧结, 复合材料, 金刚石, CuTi

Abstract: CuTi-Diamond composite was first made by microwave sintering. The process and structure of the composite was studied. Results show that graphitization of diamond was not observed during sintering at 950℃. Diamond bonds well with CuTi matrix. The density of composite increases initially as the diamond content increases and then decreases after passing a maximum at the diamond volume content of about 18.75~25vol%.

Key words: microwave sintering, composite, diamond, CuTi

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