金属Cu和5YSZ陶瓷的“闪连”研究

doi:10.15541/jim20240515

摘要/Abstract

摘要：

陶瓷与金属的连接能满足工程领域对高性能结构部件的需求。然而, 金属和陶瓷热膨胀系数的显著差异, 以及金属对陶瓷表面的润湿性较差, 使得陶瓷与金属的连接面临诸多挑战。本研究采用“闪连”技术, 在电场/电流的辅助作用下和相对低的温度下实现了金属Cu和5YSZ(5%氧化钇稳定氧化锆, 摩尔分数)陶瓷的快速连接。研究了电场强度、电流密度和连接时间对金属Cu和5YSZ“闪连”行为和连接程度的影响, 分析讨论了金属Cu和5YSZ的“闪连”机理。结果表明, 在温度为753 ℃、电流密度为10 A/cm²、连接时间为3 min的条件下, 金属Cu和5YSZ的连接界面最致密。进一步提高温度、增大电流或延长“闪连”时间, 连接接头开始恶化, 甚至发生断裂。当“闪连”发生时, 样品中会发生电化学反应, 并产生氧空位缺陷。物相分析和微观结构分析表明, 在电化学反应作用下, 原子扩散促进了Cu和5YSZ的连接, 其中Cu原子扩散进入5YSZ晶格中, 被还原的Zr原子扩散进入Cu晶格中。此外, 电场方向对Cu和5YSZ的连接有极大影响。当电场方向从5YSZ到Cu时, 可实现良好连接; 当电场方向从Cu到5YSZ时, 二者无法实现连接。

关键词: 连接, 电场, 低温, 电化学反应, 氧空位

Abstract:

Joining of ceramic and metal meets the engineering needs for high-performance structural components. However, the significant difference in thermal expansion coefficients between metals and ceramics, as well as the poor wettability of metals on ceramic surfaces, makes the joining of ceramics and metals face many challenges. In this study, “flash joining” technology was used to achieve the rapid connection of metal Cu and 5YSZ (5% yttria stabilized zirconia, molar fraction) ceramics at a relatively low temperature under the assistance of electric field/current. The effects of electric field, current density, and joining time on the “flash joining” behavior and the degree of bonding between Cu and 5YSZ were investigated. Moreover, the mechanism of “flash joining” between Cu and 5YSZ was discussed. The results showed that the densest joint between Cu and 5YSZ was obtained at a temperature of 753 ℃, a current density of 10 A/cm² and a joining time of 3 min. However, the joint began to deteriorate and even fracture when the temperature, current and joining time were further increased. Electrochemical reactions occurred during the “flash joining” process, introducing oxygen vacancy defects. Phase and microstructural analyses indicated that atomic diffusion driven by electrochemical reactions facilitated the joining of Cu and 5YSZ, with Cu atoms diffusing into the 5YSZ lattice and reduced Zr atoms diffusing into the Cu lattice. In addition, the direction of the electric field had a significant impact on the bonding between Cu and 5YSZ. A good bond was achieved when the electric field was oriented from 5YSZ to Cu, while the bonding did not occur when the electric field direction was from Cu to 5YSZ.

Key words: joining, electric field, low temperature, electrochemical reaction, oxygen vacancy

中图分类号:

TB32

李汶金, 娄程广, 张帅, 苏兴华. 金属Cu和5YSZ陶瓷的“闪连”研究[J]. 无机材料学报, 2025, 40(9): 957-963.

LI Wenjin, LOU Chengguang, ZHANG Shuai, SU Xinghua. Flash Joining of Metal Cu with 5YSZ Ceramics[J]. Journal of Inorganic Materials, 2025, 40(9): 957-963.

图/表 12

图1 “闪连”连接装置示意图

Fig. 1 Schematic diagram of the flash joining apparatus

图2 通过样品的电流密度随炉温的变化曲线

Fig. 2 Current density through the sample as a function of furnace temperature

图3 功率耗散随炉温的变化曲线

Fig. 3 Power dissipation as a function of furnace temperature

图4 “闪连”前后5YSZ陶瓷的XRD图谱

Fig. 4 XRD patterns of the 5YSZ ceramics before and after flash joining

图5 “闪连”前(左: 1-5YSZ; 2-Cu; 3-5YSZ)后(右: 1, 2-Cu-5YSZ; 3-5YSZ)样品的照片

Fig. 5 Photographs of the samples before (left: 1-5YSZ; 2-Cu; 3-5YSZ) and after flash joining (right: 1, 2-Cu-5YSZ joined sample; 3-5YSZ)

图6 不同“闪连”时间所得接头的SEM照片

Fig. 6 SEM images of the joints with different flash joining times (a) 2 min; (b) 3 min; (c) 5 min; (d) 7 min. Preparation condition: 80 V/cm, 10 A/cm2, 753 ℃

图7 不同“闪连”时间下样品的EPR图谱

Fig. 7 EPR spectra of the samples with different flash joining times Preparation condition: 80 V/cm, 10 A/cm2

图8 不同“闪连”温度所得接头的SEM照片

Fig. 8 SEM images of the joints flash-jointed at different flash joining temperatures (a) 641 ℃; (b) 780 ℃. Preparation condition: 10 A/cm2, 3 min

图9 电流密度12 A/cm2、“闪连”温度753 ℃、“闪连”时间3 min条件下所得接头的SEM照片

Fig. 9 SEM images of the joint flash-jointed at a current density of 12 A/cm2, a flash joining temperature of 753 ℃, and a flash joining time of 3 min (b) Local area magnification of Fig. (a)

图10 电流密度10 A/cm2、“闪连”温度753 ℃、“闪连”时间3 min条件下所得接头的(a) SEM照片及(b~e)元素分布图

Fig. 10 (a) SEM image and (b-e) element distributions of the joint flash-jointed at a current density of 10 A/cm2, a flash joining temperature of 753 ℃, and a flash joining time of 3 min Colorful figures are available on website

图11 “闪连”后样品的(a) O1s、(b) Cu2p和(c) CuKLL的XPS谱图

Fig. 11 XPS spectra of (a) O1s, (b) Cu2p and (c) CuKLL of the samples after flash joining Colorful figures are available on website

图12 “闪连”机理图

Fig. 12 Diagram of flash joining mechanism

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