无机材料学报 ›› 2022, Vol. 37 ›› Issue (3): 267-277.DOI: 10.15541/jim20210705 CSTR: 32189.14.10.15541/jim20210705
所属专题: 增材制造专题(2022)
杨勇1,2(), 郭啸天1,3, 唐杰1,2, 常浩天1,3, 黄政仁1,2, 胡秀兰3(
)
收稿日期:
2021-11-15
修回日期:
2021-12-23
出版日期:
2022-03-20
网络出版日期:
2022-01-06
通讯作者:
胡秀兰, 教授. E-mail: whoxiulan@163.com
作者简介:
杨 勇(1974-), 男, 研究员. E-mail: yangyong@mail.sic.ac.cn
基金资助:
YANG Yong1,2(), GUO Xiaotian1,3, TANG Jie1,2, CHANG Haotian1,3, HUANG Zhengren1,2, HU Xiulan3(
)
Received:
2021-11-15
Revised:
2021-12-23
Published:
2022-03-20
Online:
2022-01-06
Contact:
HU Xiulan, professor. E-mail: whoxiulan@163.com
About author:
YANG Yong (1974-), male, professor. E-mail: yangyong@mail.sic.ac.cn
Supported by:
摘要:
目前光固化3D打印技术因打印成型精度高而被广泛应用于陶瓷增材制造, 其中非氧化物陶瓷如碳化硅、氮化硅等因打印材料粉体折射率和吸光度比较高, 光固化陶瓷浆料存在分散稳定性差、入射光难穿透并产生光固化反应的固化层厚度低等问题, 导致其固含量很难提高甚至于无法打印成型。高固含量的非氧化物陶瓷打印成型成为光固化3D打印的主要难点, 吸引了广大学者对其光固化机理、粉体调控等机制进行研究。本文系统地总结了几种非氧化物陶瓷光固化浆料的制备、光固化成型、有机物去除及烧结致密化的研究工作, 并就如何对光敏树脂组成进行调节、对陶瓷粉体进行改性的几种方法进行分析与讨论, 针对性地提出创新方案来改善非氧化物陶瓷的浆料性能、光固化打印优化和致密化缺陷修复及性能提升, 最终推动大尺寸、复杂结构的非氧化物陶瓷部件光固化增材制造高精度制备技术的进步。
中图分类号:
杨勇, 郭啸天, 唐杰, 常浩天, 黄政仁, 胡秀兰. 非氧化物陶瓷光固化增材制造研究进展及展望[J]. 无机材料学报, 2022, 37(3): 267-277.
YANG Yong, GUO Xiaotian, TANG Jie, CHANG Haotian, HUANG Zhengren, HU Xiulan. Research Progress and Prospects of Non-oxide Ceramic in Stereolithography Additive Manufacturing[J]. Journal of Inorganic Materials, 2022, 37(3): 267-277.
Material | Absorbance (d/μm, λ/nm) | Refractive index (d/μm, λ/nm) |
---|---|---|
Al2O3[ | 0.044 (10, 405) | 1.787 (2.3, 365) |
ZrO2[ | 0.003 (10, 405) | Low |
ZTA[ | Low | Low |
SiO2[ | Low | 1.564 (2.25, 365) |
SiC[ | 0.479 (10, 405) | 2.553 (12.25, 467-691) |
Si3N4[ | 0.180 (5, 405) | 2.023 (-, 632.8) |
TiO2[ | Low | 2.493 (-, 632.8) |
BN[ | High | High |
表1 陶瓷材料的折射率和吸光度
Table 1 Refractive index and absorbance of ceramic materials
Material | Absorbance (d/μm, λ/nm) | Refractive index (d/μm, λ/nm) |
---|---|---|
Al2O3[ | 0.044 (10, 405) | 1.787 (2.3, 365) |
ZrO2[ | 0.003 (10, 405) | Low |
ZTA[ | Low | Low |
SiO2[ | Low | 1.564 (2.25, 365) |
SiC[ | 0.479 (10, 405) | 2.553 (12.25, 467-691) |
Si3N4[ | 0.180 (5, 405) | 2.023 (-, 632.8) |
TiO2[ | Low | 2.493 (-, 632.8) |
BN[ | High | High |
Material | Flexural strength/MPa | Elasticity modulus/GPa | Fracture toughness/ (MPa·m1/2) |
---|---|---|---|
RB-SiC[ | ≥330 | ≥340 | ≥4.1 |
S-SiC[ | 349-431 | 308-342 | 3.77 |
RB-SiC[ | (305±15) | - | - |
RB-SiC*[ | 210.4 | - | - |
(Cf)/SiC*[ | 262.6 | - | - |
表2 不同制造方式SiC陶瓷的结构与性能
Table 2 Structure and properties of SiC ceramics obtained by different manufacturing methods
Material | Flexural strength/MPa | Elasticity modulus/GPa | Fracture toughness/ (MPa·m1/2) |
---|---|---|---|
RB-SiC[ | ≥330 | ≥340 | ≥4.1 |
S-SiC[ | 349-431 | 308-342 | 3.77 |
RB-SiC[ | (305±15) | - | - |
RB-SiC*[ | 210.4 | - | - |
(Cf)/SiC*[ | 262.6 | - | - |
图4 光固化成型制备SiC陶瓷基复合材料[52]
Fig. 4 Preparation of SiC ceramic-based composite by stereolithography[52] (a) Prepared schematic of SiC ceramic-based composite by stereolithography; (b) SEM image of SiC ceramic-based composite with a diamond volume fraction of 15%; (c) SiC ceramic-based composite
图5 数字光处理技术和液态硅渗透工艺制备Cf/SiC陶瓷复合材料[46]
Fig. 5 Preparation of Cf/SiC ceramic composites by digital light processing technology and liquid silicon infiltration process[46] (a) Prepared schematic of SiC composites; (b, c) SEM images of cross section and horizontal plane of Cf/SiC composite; (d) Sintered Cf/SiC composites
图6 数字光处理成型技术制备Si3N4-SiO2陶瓷[58]
Fig. 6 Preparation of Si3N4-SiO2 ceramics by digital light processing (DLP) technology[58] (a) Schematic synthetic reaction process of oxidation of silicon nitride at high temperature; (b) SEM image of fracture surface of Si3N4-SiO2 ceramics sintered at 1350 ℃; (c) Si3N4-SiO2 ceramics with lattice structure
图7 基于数字光处理的立体光刻法制备表面氧化氮化硅粉末复杂形状陶瓷零件[60]
Fig. 7 Fabrication of complex shaped ceramic parts with surface- oxidized Si3N4 powder via digital light processing based stereolithography method[60] (a) Green Si3N4 body of a blade; (b) Green Si3N4 body of a vertebrae; (c) Sintered body of a Si3N4 gear; (d) SEM image of sintered body of a Si3N4 gear
Material | Technology | Resin+photoinitiator | Dispersant | Powder | Cured thickness /μm | Solid content/% (in volume) | Bending strength /MPa | Ref. |
---|---|---|---|---|---|---|---|---|
SiC | DLP | HDDA+DVE-3+ TPO | KOS110 | 15 μm SiC | 78 | 30 | - | [ |
SiC | DLP | HDDA+TMPTA+TPO | KOS110+ 17000 | 15 μm SiC+ ~40 nm SiC | - | 45 | 165.2 | [ |
SiC | DLP | ACMO+HDDA+ TMPTA+BAPO | 4200 | 10 μm SiC | ≈60 | 40 | 50.18 | [ |
Al2O3-Si3N4 | SLA | TMPTA+HDDA+ Irgacure 184 | PEG200+ glycerol | 1 μm Al2O3+ 200 nm Si3N4 | 40 | 47 | - | [ |
SiO2-Si3N4 | DLP | TMPTA+Irgacure 184 | - | 3.45 μm Si3N4+ Y2O3+Al2O3 | 50-60 | 50 | (77±5) | [ |
Si3N4 | DLP | HDDA+TMPTA+819 | Copolymer | 200 nm oxidized Si3N4 | 51 | - | - | [ |
Si3N4 | DLP | EA+819+HDDA+184 | Darvan | 800 nm (KH-560)Si3N4 | 50 | 45 | - | [ |
表3 高折射率、高吸光度陶瓷的光固化成型和烧结性能比较
Table 3 Comparison of molding and sintering performances in stereolithography of high refractive index and high absorbance ceramics
Material | Technology | Resin+photoinitiator | Dispersant | Powder | Cured thickness /μm | Solid content/% (in volume) | Bending strength /MPa | Ref. |
---|---|---|---|---|---|---|---|---|
SiC | DLP | HDDA+DVE-3+ TPO | KOS110 | 15 μm SiC | 78 | 30 | - | [ |
SiC | DLP | HDDA+TMPTA+TPO | KOS110+ 17000 | 15 μm SiC+ ~40 nm SiC | - | 45 | 165.2 | [ |
SiC | DLP | ACMO+HDDA+ TMPTA+BAPO | 4200 | 10 μm SiC | ≈60 | 40 | 50.18 | [ |
Al2O3-Si3N4 | SLA | TMPTA+HDDA+ Irgacure 184 | PEG200+ glycerol | 1 μm Al2O3+ 200 nm Si3N4 | 40 | 47 | - | [ |
SiO2-Si3N4 | DLP | TMPTA+Irgacure 184 | - | 3.45 μm Si3N4+ Y2O3+Al2O3 | 50-60 | 50 | (77±5) | [ |
Si3N4 | DLP | HDDA+TMPTA+819 | Copolymer | 200 nm oxidized Si3N4 | 51 | - | - | [ |
Si3N4 | DLP | EA+819+HDDA+184 | Darvan | 800 nm (KH-560)Si3N4 | 50 | 45 | - | [ |
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