Direct Bonding Copper to Aluminium Nitride Substrate

Abstract

Abstract: The effects of surface oxidation on the bonding strength were investigated. The results suggested that bonding
could not be achieved without surface oxidation because of the no wetting of Cu[O] eutectic liquid. While, the wetting of the eutectic liquid could be
promoted by surface oxidation, and the bonding strength was greatly affected by the surface oxidation form. Compared with specimen oxidized in wet
atmosphere (N₂:O₂=10:1), the specimen oxidized in dry air achieved stronger bonding strength. The bonding strength of 2.8kg·mm^-2 was
obtained for the specimen oxidized at 1300℃ for 30 min, with the 2～3μm interlayer in thickness, and CuAlO₂ as interface production.

Key words: aluminum nitride ceramic, copper, oxidation, direct bonding

CLC Number:

TQ174

XU Xin-Rui,ZHUANG Han-Rui,LI Wen-Lan,XU Shu-Yin,ZHANG Bao-Lin,JIANG Guo-Jian. Direct Bonding Copper to Aluminium Nitride Substrate[J]. Journal of Inorganic Materials.

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Direct Bonding Copper to Aluminium Nitride Substrate

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