Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiCf/SiC at Medium Temperature

doi:10.15541/jim20240273

Abstract

Abstract:

Degradation of SiC_f/SiC composites in-plane shear performance after thermal shock represents a significant challenge for the development of hot-end components in aero-engines. In this study, thermal shock performance of 2D SiC_f/SiC was evaluated by using precision temperature-controlled thermal shock equipment, and correlation between thermal shock and in-plane shear performance was established. The results showed that borosilicate glass (BSG) coating caused SiC matrix forming BSG bubbles and oxidation, while BN interfacial debonding worsened with increasing number of thermal shocks. However, the thermal shock did not affect matrix cracking and fiber bridging. Furthermore, the in-plane shear stress-strain curve maintained bilinear trend. The degradation of the in-plane shear mechanism was attributed to the thermal expansion mismatch and the oxidation of SiC matrix. The in-plane shear modulus decreased from 78.5 to 63.6 GPa, the in-plane proportional limit stress decreased from 128.9 to 99.3 MPa, and the in-plane shear stress decreased from 205.8 to 187.3 MPa. According to the in-plane shear mixing rules, the degradation of shear modulus was caused by increased interface debonding. Combined with matrix cracking stress equation, this indicated that volume fraction decreased due to SiC matrix oxidation, resulting in degradation of proportional limit stress. Based on modified rigid body sliding model, using fiber step spacing could predict the degradation of in-plane shear strength after thermal shock, with the error between the theoretical calculation results and the actual values less than 20%.

Key words: 2D SiC_f/SiC, chemical vapor infiltration, thermal shock resistance, shear performance, degradation

CLC Number:

TB332

YOU Bojie, LI Bo, LI Xuqin, MA Xuehan, ZHANG Yi, CHENG Laifei. Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiC_f/SiC at Medium Temperature[J]. Journal of Inorganic Materials, 2024, 39(12): 1367-1376.

Figures/Tables 14

Fig. 1 Thermal shock test and temperature control curves (a) Thermal shock test furnace; (b) Principle of test; (c) Cycling curve; (d) Single cycle

Fig. 2 In-plane shear stress-strain curves of 2D SiCf/SiC

Fig. 3 In-plane shear properties of 2D SiCf/SiC (a) Proportional limit stress; (b) Shear strength; (c) Young’s modulus; (d) Modulus of resilience; (e) Modulus of toughness

Fig. 4 Microstructure evolution of 2D SiCf/SiC surfaces (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

Fig. 5 XRD patterns (a) and grain size changes (b) of 2D SiCf/SiC

Fig. 6 Cross-sectional microstructure evolution of 2D SiCf/SiC (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

Fig. 7 Debonding and step spacing evolution at 2D SiCf/SiC shear interface (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

Fig. 8 Fracture microstructure morphologies of 2D SiCf/SiC (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

Fig. 9 Fracture morphologies of 2D SiCf/SiC fibers (a) As-received; (b) After 250 cycles; (c) After 500 cycles; (d) After 750 cycles; (e) Brittle fracture; (f) Toughness fracture

Fig. 10 Mechanisms of thermal shock and shear interface debonding (a)Thermal shock interface debonding; (b) Shear strain relationship

Table 1 Parameter value statistics

Parameter	Symbol	Value
Poisson’s ration of SiC fiber	v_f	0.20
Poisson’s ration of SiC matrix	v_m	0.17
Fiber volume fraction	V_f/%	0.35
Matrix cracking energy	${{\Gamma }_{\text{m}}}~$/(N·m^-1)	6.0
Interface sliding stress	${{\tau }_{\text{s}}}$/MPa	9.2
Thickness of plain woven layer	${{t}_{\text{layer}}}$/mm	0.2
SiC fiber diameter	${{d}_{\text{f}}}$/μm	12.0
SiC fiber modulus	${{E}_{\text{f}}}$/GPa	386.7
SiC matrix modulus	${{E}_{\text{m}}}$/GPa	350.0
SiC fiber shear modulus	${{G}_{\text{f}}}/$GPa	161.1
SiC matrix shear modulus	${{G}_{\text{m}}}$/GPa	149.6
BN interface shear modulus	${{G}_{\text{I}}}$/GPa	110.0

Table 2 Comparison of theoretical and actual values for shear modulus calculation

Thermal shock cycles	Percentage of debonding/ %	Theoretical value/ GPa	Actual value/ GPa	Error/ %
0	0	80.4	78.5	-2.4
250	5.56	78.2	83.6	6.9
500	13.90	74.6	58.6	-21.4
750	56.10	50.0	63.6	27.2

Fig. 11 Mechanism of thermal shock oxidation blistering

Table 3 Comparison of theoretical and actual shear strength values

Thermal shock cycles	Fiber step spacing/ mm	Theoretical value/ MPa	Actual value/ MPa	Error/ %
0	79.0	178.6	205.8	15.2
250	97.5	193.4	209.6	8.4
500	49.0	162.6	186.5	14.7
750	67.3	170.8	187.3	9.7

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