Journal of Inorganic Materials

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Effects of Growth Temperature on AlxGa1-xN Thin Films on Sapphire with High Al Contents

JI Zhen-Guo1,2, LOU Yao1, MAO Qi-Nan2   

  1. 1. Institute of Electronic Information, Hangzhou Dianzi University, Hangzhou 310018, China; 2. State Key Laboratory for Silicon Materials, Zhejiang University, Hangzhou 310027, China
  • Received:2009-06-25 Revised:2009-11-02 Published:2010-04-20 Online:2010-04-27

Abstract: Deposition parameters are important to the characteristics of the AlxGa1-xNfilms. Effects of the deposition temperature on the defects densities and the photoluminescence of the AlxGa1-xN films with high Al content were investigated, which is deposited by low pressure MOCVD on sapphire. High resolution XRD, UVVisible transmittance, AFM, SEM, and photoluminescence spectroscope were used to characterize the AlxGa1-xN films with high Al content. It is found that as the growth temperature increases, the screw dislocation density in AlxGa1-xN films increases, while the edge dislocation density decreases. So simply increasing deposition temperature is not a good way to reduce the total defects density or enhance the photoluminescence of the high Al content AlxGa1-xN films. Further analysis shows that higher deposition temperature is beneficial to achieve high Al content AlxGa1-xN films. It’s found that as the deposition temperature increases, Al content in AlxGa1-xN films also increases, which results in the increase of the bandgap of the films. Therefore, moderately increasing the deposition temperature (1000-1050℃)is an effective way to increase Al content in AlxGa1-xN films. Nevertheless, too higher deposition temperature (>1100℃) is detrimental for the photoluminescence of the AlxGa1-xN films.

Key words: AlGaN, high Al content, MOCVD, epitaxy, deposition temperature

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