无机材料学报 ›› 2023, Vol. 38 ›› Issue (2): 113-124.DOI: 10.15541/jim20220400

• 综述 •    下一篇

陶瓷材料电场辅助连接技术研究现状及发展趋势

刘岩1(), 张珂颖1,2, 李天宇1,2, 周菠1,2, 刘学建1, 黄政仁1   

  1. 1.中国科学院 上海硅酸盐研究所, 上海 200050
    2.中国科学院大学 材料科学与光电工程中心, 北京 100049
  • 收稿日期:2022-07-09 修回日期:2022-09-20 出版日期:2023-02-20 网络出版日期:2022-09-22
  • 作者简介:刘岩(1975-), 男, 博士, 研究员. E-mail: stony2000@mail.sic.ac.cn
  • 基金资助:
    国家自然科学基金(51972320)

Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend

LIU Yan1(), ZHANG Keying1,2, LI Tianyu1,2, ZHOU Bo1,2, LIU Xuejian1, HUANG Zhengren1   

  1. 1. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
    2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  • Received:2022-07-09 Revised:2022-09-20 Published:2023-02-20 Online:2022-09-22
  • About author:LIU Yan (1975-), male, PhD, professor. E-mail: stony2000@mail.sic.ac.cn
  • Supported by:
    National Natural Science Foundation of China(51972320)

摘要:

陶瓷材料因具有良好的机械性能、抗腐蚀性、耐高温性及抗氧化性等, 被广泛应用于航空航天、医疗、能源交通等领域, 陶瓷材料自身及其与金属材料的连接技术对于实际工程应用具有重要意义。由于部分陶瓷材料与电场的特殊作用机理, 将外加电场应用于陶瓷材料的连接技术中, 可以获得多种普通连接技术所不具备的优势, 如连接温度较低和连接时间较短等, 这就催生了新型陶瓷材料电场辅助连接技术。本文着重梳理了陶瓷及陶瓷基复合材料电场辅助连接技术的研究现状, 对近年来电场辅助连接技术的研究进展进行了综述, 重点介绍了电场辅助扩散连接(Electric field-assisted diffusion bonding, FDB) 技术、放电等离子体烧结 (Spark plasma sintering, SPS)连接技术以及新型低温快速闪连接(Flash joining, FJ) 技术的连接机理、典型界面微观结构、接头强度及影响因素等, 阐述了不同电场辅助连接技术的适用范围和局限性, 并对陶瓷材料电场辅助连接技术的发展进行了展望。

关键词: 陶瓷, 电场辅助, 电场辅助扩散连接, SPS连接, 闪连接, 综述

Abstract:

Ceramic materials are widely used in aerospace, medicine and energy transportation concerned for their excellent over-all mechanical and chemical properties, such as corrosion resistance, high temperature resistance and oxidation resistance. Especially, joining ceramic materials themselves and connecting them with metals are of great significance for the practical engineering applications. Compared with traditional joining technology, electric-assisted joining technology possesses a variety of advantages, such as low temperature and short time, owing to the special influence of the electric field on some ceramic materials. This paper focuses on the development of the electric-field assisted joining technologies of ceramics and ceramic matrix composites, and summarizes their research status in recent years. From the views of joining mechanism, typical interface microstructure and joint strength and influencing factors, the electric-field assisted diffusion bonding (FDB), spark plasma sintering (SPS) joining, and the new low-temperature rapid flash joining (FJ) are reviewed. Moreover, the applicable scope and limitations of different electric-field assisted joining technologies are expounded. In addition, the development trend of the electric-field assisted joining technology of ceramic materials is prospected.

Key words: ceramics, electric field, electric field-assisted diffusion bonding, SPS joining, flash joining, review

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