| [1]  Sheppard L M.  American Ceramic Society Bulletin,  1990,  69 (11):  1801--1812. [2]  Weimer A W, Cochran G A G, Eisman A.  J. Am. Ceram. Soc.,  1994,  77 (1):  3--18.
 [3]  Panthieu E, Grange P, Delmon B.  J. Eur. Ceram. Soc.,  1991,  8:  233--241.
 [4]  Cho Y W, Charles J A.  Mater. Sci. Tech.,  1991,  7:  495--504.
 [5]  Haussonne J M, Lostec J, Bertot J P.  Am. Ceram. Soc. Bull.,  1993,  72 (5):  84--90.
 [6]  Nickel K G, Riedel R, Petzow G.  J. Am. Ceram. Soc.,  1989,  72 (10):  1804--1810.
 [7]  Seibold M M, Rüssel C.  J. Am. Ceram. Soc.,  1989,  72 (3):  333--337.
 [8]  Costantino M, Firpo C.  J. Mater. Res.,  1991,  6 (11):  2397--2402.
 [9]  Lee W C, Tu C-L, Weng C Y,  et al. J. Mater. Res.,  1995,  10 (3):  774--778.
 [10]  Varma A, Lebrat J P.  Chem. Eng. Sci.,  1992,  47 (9-11):  2179--2194.
 [11]  江国键, 庄汉锐, 李文兰, 等. 粉末冶金技术, 1998,  16 (1):  26--32.
 [12]  江国键, 庄汉锐, 王本民, 等. 人工晶体学报, 1999,  28 (4):  382--386.
 [13]  江国键, 庄汉锐, 王本民, 等. 人工晶体学报, 1999,  28 (4):  387--391.
 [14]  Lee K J, Ahn D H, Kim Y S.  J. Am. Ceram. Soc.,  2000,  83 (5):  1117--1121.
 [15]  Chen K X, Ge C C. Li J T,  et al. J. Mater. Res.,  1999,  14 (5):  1944--1948.
 [16]  Chen K X, Jin H B, Zhou H P,  et al. J. Eur. Ceram. Soc.,  2000,  20 (14-15):  2601--2606.
 [17]  Cano I G, Baelo S P, Rodríguez M A,  et al. J. Eur. Ceram. Soc.,  2001,  21:  291--295.
 [18]  Chung S L, Yu W L, Lin C N.  J. Mater. Res.,  1999,  14 (5):  1928--1933.
 [19]  Mandorf V Jr., “preparation of aluminum nitride,” U. S. Patent, 3 307 908  (1967).
 [20]  Lee W C, Chung S L.  J. Mater. Res.,  1997,  12 (3):  805--811.
 [21]  Chen K X, Jin H, Oliveira M,  et al. J. Mater. Res.,  2001,  16 (7):  1928--1934.
 [22]  Burton W K, Cabrera N, Frank F C.  Phil. Royal. Soc.,  1950,  243:  299.
 [23]  王华彬, 韩杰才, 郑永挺, 等. 材料研究学报, 2000,  14(suppl):  158--162.
 [24]  Horvath S F, Witek S R, Harmer M P., “Effects of Carbon and Calcium Oxide on the Sintering Behaviour of Aluminum Nitride?”; in Edited by M. F. Yan, K. Niwa, H. M. O’ Bryan, Jr. Advances in ceramics, volume 26, Ceramic substrates and packages for electronic applications. Westerville, Ohio: The American Ceramic Soc. Inc., 1987. 121-132.
 [25]  Ohyanagi M, Shirai K, Balandina N, et al. J. Am. Ceram. Soc., 2000,  83 (5):  1108--1112.
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