Dielectric Materials for High Frequency Multilayer Chip Inductors

Journal of Inorganic Materials

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Dielectric Materials for High Frequency Multilayer Chip Inductors

LUO Ling-Hong; ZHOU He-Ping; WANG Shao-Hong; ZHA Zheng

State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China

Received:2000-09-22 Revised:2000-10-24 Published:2001-09-20 Online:2001-09-20

Abstract

Abstract: The low firing temperature glass-ceramics of B₂O₃-P₂O₅-MgO-Al₂O₃-SiO₂ system were investigated. The dependence of heat-treatment on crystallizing phases and the properties of crystallizing phases were analyzed. This material with low dielectric constant and low loss tangent can be co-fired with Au, Ag/Pb, Cu paste under 1000℃, it can be a promising material for high frequency MLCIs.

Key words: high frequency chip inductors, low dielectric constant ceramic materials, low temperature-firing

CLC Number:

TM28

LUO Ling-Hong,ZHOU He-Ping,WANG Shao-Hong,ZHA Zheng. Dielectric Materials for High Frequency Multilayer Chip Inductors[J]. Journal of Inorganic Materials.

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Dielectric Materials for High Frequency Multilayer Chip Inductors

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