Flash Joining of Metal Cu with 5YSZ Ceramics

doi:10.15541/jim20240515

Abstract

Abstract:

Joining of ceramic and metal meets the engineering needs for high-performance structural components. However, the significant difference in thermal expansion coefficients between metals and ceramics, as well as the poor wettability of metals on ceramic surfaces, makes the joining of ceramics and metals face many challenges. In this study, “flash joining” technology was used to achieve the rapid connection of metal Cu and 5YSZ (5% yttria stabilized zirconia, molar fraction) ceramics at a relatively low temperature under the assistance of electric field/current. The effects of electric field, current density, and joining time on the “flash joining” behavior and the degree of bonding between Cu and 5YSZ were investigated. Moreover, the mechanism of “flash joining” between Cu and 5YSZ was discussed. The results showed that the densest joint between Cu and 5YSZ was obtained at a temperature of 753 ℃, a current density of 10 A/cm² and a joining time of 3 min. However, the joint began to deteriorate and even fracture when the temperature, current and joining time were further increased. Electrochemical reactions occurred during the “flash joining” process, introducing oxygen vacancy defects. Phase and microstructural analyses indicated that atomic diffusion driven by electrochemical reactions facilitated the joining of Cu and 5YSZ, with Cu atoms diffusing into the 5YSZ lattice and reduced Zr atoms diffusing into the Cu lattice. In addition, the direction of the electric field had a significant impact on the bonding between Cu and 5YSZ. A good bond was achieved when the electric field was oriented from 5YSZ to Cu, while the bonding did not occur when the electric field direction was from Cu to 5YSZ.

Key words: joining, electric field, low temperature, electrochemical reaction, oxygen vacancy

CLC Number:

TB32

LI Wenjin, LOU Chengguang, ZHANG Shuai, SU Xinghua. Flash Joining of Metal Cu with 5YSZ Ceramics[J]. Journal of Inorganic Materials, 2025, 40(9): 957-963.

Figures/Tables 12

Fig. 1 Schematic diagram of the flash joining apparatus

Fig. 2 Current density through the sample as a function of furnace temperature

Fig. 3 Power dissipation as a function of furnace temperature

Fig. 4 XRD patterns of the 5YSZ ceramics before and after flash joining

Fig. 5 Photographs of the samples before (left: 1-5YSZ; 2-Cu; 3-5YSZ) and after flash joining (right: 1, 2-Cu-5YSZ joined sample; 3-5YSZ)

Fig. 6 SEM images of the joints with different flash joining times (a) 2 min; (b) 3 min; (c) 5 min; (d) 7 min. Preparation condition: 80 V/cm, 10 A/cm2, 753 ℃

Fig. 7 EPR spectra of the samples with different flash joining times Preparation condition: 80 V/cm, 10 A/cm2

Fig. 8 SEM images of the joints flash-jointed at different flash joining temperatures (a) 641 ℃; (b) 780 ℃. Preparation condition: 10 A/cm2, 3 min

Fig. 9 SEM images of the joint flash-jointed at a current density of 12 A/cm2, a flash joining temperature of 753 ℃, and a flash joining time of 3 min (b) Local area magnification of Fig. (a)

Fig. 10 (a) SEM image and (b-e) element distributions of the joint flash-jointed at a current density of 10 A/cm2, a flash joining temperature of 753 ℃, and a flash joining time of 3 min Colorful figures are available on website

Fig. 11 XPS spectra of (a) O1s, (b) Cu2p and (c) CuKLL of the samples after flash joining Colorful figures are available on website

Fig. 12 Diagram of flash joining mechanism

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