无机材料学报

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r.f.PCVD法制备c-BN膜的研究

张晓玲1,2; 胡奈赛1; 何家文1   

  1. 1. 西安交通大学金属材料强度国家重点实验室, 西安 710049; 2. 山东工业大学材料科学与工程学院 济南 250061
  • 收稿日期:1998-09-14 修回日期:1998-10-16 出版日期:1999-08-20 网络出版日期:1999-08-20

Study on c BN Films Deposited by r f Plasma assisted CVD

ZHANG Xiao-Ling1,2; HU Nai-Sai 1, HE Jia-Wen1   

  1. 1.State Key Laboratory for Mechanical Behavior of Materials; Xi an Jiaotong University Xi an 710049 China; 2. Materials Science and Engineering Institute; Shandong University of Technology Jinan 250061 China
  • Received:1998-09-14 Revised:1998-10-16 Published:1999-08-20 Online:1999-08-20

摘要: 采用 F T I R、 T E M、 S E M 等技术, 对在渗硼层表面经r.f. P C V D 沉积的 B N 膜进行了研究试验证明, 与采用 N 气和 H 气相比, 以 Ar + 10vol% H 作为载气, 所获得的膜层c-B N 含量最高, 膜厚最大, 可达4.6μm , 且膜基结合良好而以 N 气或 H 气为载气时, 前者会导致膜基结合力大大下降, 后者会引起沉积速度明显降低结果表明, 对于 P C V D 过程, 控制c- B N 形成的主要因素是离子轰击能量的转移, 而不是氢的选择溅射过程试验获得的膜层由a- B N 和c- B N 组成, c- B N的尺寸为20 ~40nm

关键词: c-BN膜, r.f.PCVD, 载气

Abstract: Boron nitride (BN) films were deposited on a pre-boronised AISI 5140 substrate by r. f. plasma-assisted CVD technique, with nitrogen (N2),
hydrogen (H2) or H2 diluted at 10 vol% in argon (Ar) being carrier gas. It was found by FTIR and SEM analyses that for the three kinds of carrier gas
the c-BN content was the highest if Ar+10% H2 was used, the film thickness was the thinnest if H2 was used, and the bonding strength of the film
determined through indentation test, was the poorest if N2 was used as the carrier gas. TEM analysis indicated that most of the films were the
mixtures of amorphous and cubic BN phases, with the sizes of the c-BN particles being 20--40 nm.

Key words: c-BN films, r. f. PCVD, carrier gas

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