Low-Temperature Sintering of NiCuZn Ferrite for Multilayer-chip Inductor

Abstract

Abstract: The sintering below 900"C of NiCuZn ferrite was realized by using Bi₂O₃ additions. Themechanism of low-temperature sintering was discussed by means of TG,DTA and DDTA. The resultshows the optimum sintering temperature range is 850~ 900℃ and a second phase, Bi₃₆Fe₂O₅₇formed. The solution of Fe is helpful in both stabilizing cubic structure of r-Bi₂O₃and keepingaway from crystal transition during cooling. Bi₃₆Fe₂O₅₇ prevents grain growth effectively, so thatthe modification of NiCuZn ferrite can be achieved.

Key words: multilayer-chip inductor, ferrite, NiCuZn system, low-temperature sintering

CLC Number:

TM271

HE Xin-Hua,XIONG Mao-Ren,LING Zhi-Yuan,QIU Qi-Chun. Low-Temperature Sintering of NiCuZn Ferrite for Multilayer-chip Inductor[J]. Journal of Inorganic Materials.

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Low-Temperature Sintering of NiCuZn Ferrite for Multilayer-chip Inductor

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