Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer

Journal of Inorganic Materials

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Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer

MA Zhi-Bin¹; WU Qin-Chong¹; WANG Jian-Hua²; WANG Chuan-Xin²; LI Xiang-Feng ³

1.Institute of plasma physics; Chinese Academy of Sciences; Hefei 230031; China; 2. Department of Material Engineering; Wuhan Chemical Industry College; Wuhan 430074, China; 3. Department of Mechanical Engineering, NUAA Nanjing, Nanjing 210016, China

Received:1999-09-21 Revised:2000-01-04 Published:2000-10-20 Online:2000-10-20

Abstract

Abstract: The chemical vapor deposition of diamond films on copper substrate with Ni intermediate layer was studied.
The adhesion of the diamond film on the copper substrate was improved due to the formation of a Cu-Ni eutectic between the copper and the Ni
interlayer. Scanning electron microscopy and Raman spectroscopy were used to investigate the films: The diamond films with (100) oriented diamond
particles were obtained under suitable conditions, which involved scratching carefully the substrate with diamond grits and subsequently
annealing the substrate with high temperature hydrogen plasma. The uniformity of the Cu--Ni--C--H eutectic influenced the uniformity of
the diamond film.

Key words: diamond film, chemical vapor deposition, intermediate layer

CLC Number:

O484

MA Zhi-Bin,WU Qin-Chong,WANG Jian-Hua,WANG Chuan-Xin,LI Xiang-Feng. Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer[J]. Journal of Inorganic Materials.

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Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer

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