Improvement of Adhesive Strength of Diamond Films by Plating Cr-diamond Composite Interlayer

doi:10.3724/SP.J.1077.2012.00205

Abstract

Abstract:

The diamond films were fabricated by using a two-step process on copper substrates. Firstly, chromium (Cr)-diamond composite interlayer was electroplated on copper substrates, then continuous diamond films were deposited by using hot-filament chemical vapor deposition (HFCVD) method. The interfacial characteristics were investigated by indentation test. The film surface morphology, phase structure and inner stress were analyzed by scanning electron microscope (SEM), X-ray diffraction (XRD) and Raman spectrum. The results show that the diamond particles are deeply imbedded in chromium layer and the amorphous Cr in the composite interlayer is carborized to Cr₃C₂in the CVD process. Low inner stress is detected in the diamond films and good adhesive strength between film and substrate is obtained due to the deep anchoring of the diamond particles in the Cr₃C₂ matrix. Concentric cracks but no delaminate area and radial cracks are observed on the periphery of the indentation in 294 N load indentation test.

Key words: diamond films, inlay structure, composite plating, indentation, adhesive strength

CLC Number:

TB43

QIU Wan-Qi, PAN Jian-Wei, LIU Zhong-Wu, YU Hong-Ya, ZHONG Xi-Chun, ZENG De-Chang. Improvement of Adhesive Strength of Diamond Films by Plating Cr-diamond Composite Interlayer[J]. Journal of Inorganic Materials, 2012, 27(2): 205-208.

Figures/Tables 5

Fig. 1 SEM surface morphologies of samples after Cr-diamond composite plating (a) Distribution and density of diamond particles; (b) A deeply imbedded diamond particle

Fig. 2 XRD patterns of the sample prepared after first (a) and second (b) step fabrication

Fig. 3 Surface morphology (a) and Raman spectrum (b) of the diamond films after 16 h CVD process

Fig. 4 SEM micrographs of the indentation crater on inlay structure diamond films (a) and the concentric cracks on periphery of the crater (b)

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