无机材料学报

• 研究论文 • 上一篇    

液相连接氮化硅陶瓷的结合强度研究

解荣军; 黄莉萍; 陈源; 徐鑫; 符锡仁   

  1. 中国科学院上海硅酸盐研究所; 上海 200050
  • 收稿日期:1997-07-10 修回日期:1997-08-20 出版日期:1998-10-20 网络出版日期:1998-10-20

Bond Strength of Joined Silicon Nitride Ceramics by Liquid Phase Bonding Method

XIE Rong-Jun; HUANG Li-Ping; CHEN Yuan; XU Xin; FU Xi-Ren   

  1. Shanghai Institute of Ceramics; Chinese Academy of Sciences Shanghai 200050 China
  • Received:1997-07-10 Revised:1997-08-20 Published:1998-10-20 Online:1998-10-20

摘要: 本文用玻璃焊料研究了氮化硅陶瓷的液相连接,探讨了组份(0~10wt%α-Si3N4)、温度(1450~1650℃)和保温时间(10~120min)对结合强度的影响规律.结果表明,α-Si3N4的加入提高了液态焊料的粘度,降低了焊料的流动性,导致结合强度下降.采用组份为不含α-Si3N4的纯氧化物玻璃焊料在1600℃、保温30min可以得到较为理想的结合强度.

关键词: 氮化硅, 连接, 结合强度

Abstract: The liquid phase bonding of silicon nitride ceramics by using glass adhesives was studied. The effects of adhesive composition
and joining conditions such as temperature (1450~1650℃) and holding time (10~120min) on the bond strength of the joint were
investigated. The results showed that increasing viscosity of the adhesive by the addition of α-Si3N4 powder to the glass, and
consequently reducing fluidity of the adhesive degraded the bond strength. The op

Key words: silicon nitride, bonding, bond strength

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