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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

残余应力对Si3N4/S45C连接体强度的影响

邱建辉; 中村谕; 川越诚; 森田干郎   

  1. 富山县立大学工学部, 富山县射水郡小杉町黑河5180, 日本 939-0398
  • 收稿日期:1997-08-18 修回日期:1997-09-17 出版日期:1998-08-10 网络出版日期:1998-08-10

Influence of Joining Strength of Si3N4/S45C on Residual Stress

QIU J H; Nakamura S; Kawagoe M; Morita M   

  1. Department of Mechanical Systems Engineering; Faculty of Engineering; Toyama Prefectrual University; 5180 Kurokawa; Kosuge; Toyama 939-03; Japan
  • Received:1997-08-18 Revised:1997-09-17 Published:1998-08-10 Online:1998-08-10

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摘要： 本文主要就Si3N4／S45C连接体在插入软金属及附加热循环的情况下，使残余应力发生变化，而讨论其对抗弯强度的影响．其结果为：（1）Si3N4表面边缘处的拉伸应力是影响连接体强度的主要原因．（2）抗弯强度和残余应力具有σ0＝-1．63σ＋658．1的线性关系．（2）周期性热循环对连接体的残余应力及抗弯强度有较大的影响；即发生加工硬化等使残余应力上升，产生裂纹等导致强度下降．

关键词: 陶瓷, 金属, 连接, 残余应力, 抗弯强度, 热循环

Abstract: According to Si3N4/S45C joining sample with soft metal interlayer in the thermalload, the effect of residual stress on bending strength was studied.

Some results obtained are as follows. (1) The tension stress in the edge of Si3N4 section is mainly reason to affect the bonding strength. (2) There is a linear
relationship (σ0=-1.63σ+658.1) between the bending strength and the residual stress. (3) The heat cycle results in machining hardening of join samples,
so that the residual stress increases and at the same time the cracks formed make the strength decreased.

Key words: ceramics, metal, joining, residual stress, bending strength, heat cycle

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