Journal of Inorganic Materials

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Joining of 2D C/SiC Composites with Niobium Alloy

XIONG Jiang-Tao, LI Jing-Long, ZHANG Fu-Sheng, HUANG Wei-Dong   

  1. School of Materials, Northwestern Polytechnical University, Xi’an 710072, China
  • Received:2005-11-21 Revised:2006-03-13 Published:2006-11-20 Online:2006-11-20

Abstract: 2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface.
The highest shear stress of joint is 14.1 MPa.

Key words: C/SiC composites, niobium alloy, joining

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