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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

(YCa)F3助烧AIN陶瓷的显微结构和热导率

刘耀诚; 周和平; 乔梁   

  1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084
  • 收稿日期:1999-08-16 修回日期:1999-09-20 出版日期:2000-08-20 网络出版日期:2000-08-20

Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F3 as Sintering Aid

LIU Yao-Cheng; ZHOU He-Ping; QIAO Liang   

  1. State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China
  • Received:1999-08-16 Revised:1999-09-20 Published:2000-08-20 Online:2000-08-20

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摘要： 采用（ＣａＹ）Ｆ３为助烧结剂，低温烧结（１６５０℃， ６ｈ）制备出热导率为２０８Ｗ／ｍ·Ｋ的ＡＩＮ陶瓷，在烧结过程中，热导率随保温时间的变化服从方程：λ（ｔ）＝λ∞－△λ（０）·ｅ－ｔ／ｒ·用ＳＥＭ、 ＳＴｈＭ、 ＴＥＭ和 ＨＲＥＭ对 ＡＩＮ陶瓷的显微结构及其对热导率的影响进行了研究，结果表明，晶粒尺寸对ＡＩＮ陶瓷热导率的影响可以忽略，而分隔在ＡＩＮ晶粒之间的晶界相会降低热导率。

关键词: 氮化率, 烧结, 热导率, 显微结构, 扫描热显微镜

Abstract: Aluminium nitride ceramics were successfully fabricated through low-temperature sintering by using (YCa)F3 as the sintering aid. AIN ceramics with a high thermal conductivity of 208W/m·K were obtained after the specimen was sintered at 1650℃ for 6h. Calculation based on the present and reported results led to an equation which describes the dependence of thermal conductivity of AIN on the soaking time in sintering: λ(t) =λ∞ -△λ(0)·e-t/r. SEM, TEM, SThM and HREM were employed to study, the microstructure-property relationship of AlN ceramics. It was concluded that AlN grain sizes
have little effect on the thermal conductivity, while grain boundary phases deteriorate thermal conductivity.

Key words: aluminium nitride, sintering, thermal conductivity, microstructure, SThM

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