Na2O-B2O3-SiO2玻璃焊料连接碳化硅陶瓷接口抗热震性能

doi:10.3724/SP.J.1077.2012.00234

无机材料学报 ›› 2012, Vol. 27 ›› Issue (3): 234-238.DOI: 10.3724/SP.J.1077.2012.00234 CSTR: 32189.14.SP.J.1077.2012.00234

Na₂O-B₂O₃-SiO₂玻璃焊料连接碳化硅陶瓷接口抗热震性能

罗朝华^1,2, 江东亮¹, 张景贤¹, 林庆玲¹, 陈忠明¹, 黄政仁¹

(1. 中国科学院上海硅酸盐研究所高性能陶瓷和超微结构国家重点实验室, 上海200050; 2. 中国科学院研究生院, 北京100049)

收稿日期:2011-03-25 修回日期:2011-06-03 出版日期:2012-03-20 网络出版日期:2012-02-16
作者简介:罗朝华(1984-), 男, 博士研究生. E-mail: zhluo@mail.sic.ac.cn
基金资助:
国家自然科学基金(50990301, 51072210)

Thermal Shock Behavior of the SiC-SiC Joints Joined with Na₂O-B₂O₃-SiO₂ Glass Solder

LUO Zhao-Hua^1,2, JIANG Dong-Liang¹, ZHANG Jing-Xian¹, LIN Qing-Ling¹, CHEN Zhong-Ming¹, HUANG Zheng-Ren¹

(1. State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China; 2. Graduate University of the Chinese Academy of Sciences, Beijing 100049, China)

Received:2011-03-25 Revised:2011-06-03 Published:2012-03-20 Online:2012-02-16
About author:LUO Zhao-Hua. E-mail: zhluo@mail.sic.ac.cn
Supported by:
National Natural Science Foundation of China (50990301, 51072210)

摘要/Abstract

摘要： 采用水淬法对以Na₂O-B₂O₃-SiO₂体系玻璃焊料连接的常压烧结碳化硅试条的抗热震性能进行了研究. 对不同温度下淬火后接口以及断面处微观结构进行了比较与分析, 并对比了不同淬火温度以及固定淬火温度为150℃时多次热循环后连接试条的残余弯曲强度. 结果表明, 对于单次淬火, 当淬火温度为150℃时, 由于热应力引起中间层内部微裂纹扩展, 导致残余弯曲强度迅速降低到(152±28) MPa. 淬火温度在150℃~320℃时, 中间层内部裂纹保持在亚临界状态, 相应弯曲强度基本保持在140 MPa. 继续升高淬火温度至420℃时, 裂纹进一步扩展, 试条残余弯曲强度迅速降低至(32±8) MPa. 对于多次热循环, 当淬火温度固定在150℃时, 经多次热循环, 残余弯曲强度与热循环次数变化不明显, 基本保持在120 MPa左右, 这说明在150℃以下淬火, 连接试条具有较好的抗热循环冲击性能.

关键词: 热震性, 接口, 残余弯曲强度, 玻璃焊料

Abstract: Water-quenching technique was used to evaluate the thermal shock behavior of the SiC-SiC joints joined with Na₂O-B₂O₃-SiO₂ glass solder. The microstructure of the side view of the interface and the fracture surface of the joints after quenching were analyzed. The influence of the quenching temperature and quenching cycles from 150℃ to cool water on the residual strength of the specimens were investigated. At the quenching temperature of 150℃, the residual strength of the joint decreased to (152±28) MPa due to the propagation of the microcracks in the interlayer caused by the thermal residual stress after one thermal cycle. At the quenching temperature from 150℃ to 320℃, the cracks seemed to be in subcritical state, and the residual strength was kept around 140 MPa. When the quenching temperature was increased to 420℃ or higher, the cracks propagation became more serious, and the strength decreased to (32±8) MPa rapidly. Moreover, the residual strength was hardly affected by the quenching cycles from 150℃ to cool water which meant that the joined specimens possesed good thermal shock resistance behavior at this temperature.

Key words: thermal shock resistance, joint, residual strength, glass solder

中图分类号:

TQ174

罗朝华, 江东亮, 张景贤, 林庆玲, 陈忠明, 黄政仁. Na₂O-B₂O₃-SiO₂玻璃焊料连接碳化硅陶瓷接口抗热震性能[J]. 无机材料学报, 2012, 27(3): 234-238.

LUO Zhao-Hua, JIANG Dong-Liang, ZHANG Jing-Xian, LIN Qing-Ling, CHEN Zhong-Ming, HUANG Zheng-Ren. Thermal Shock Behavior of the SiC-SiC Joints Joined with Na₂O-B₂O₃-SiO₂ Glass Solder[J]. Journal of Inorganic Materials, 2012, 27(3): 234-238.

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Na₂O-B₂O₃-SiO₂玻璃焊料连接碳化硅陶瓷接口抗热震性能

Thermal Shock Behavior of the SiC-SiC Joints Joined with Na₂O-B₂O₃-SiO₂ Glass Solder

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