2D SiCf/SiC中温热冲击损伤与面内剪切性能退化规律

doi:10.15541/jim20240273

无机材料学报 ›› 2024, Vol. 39 ›› Issue (12): 1367-1376.DOI: 10.15541/jim20240273 CSTR: 32189.14.10.15541/jim20240273

所属专题：【结构材料】超高温结构陶瓷(202412)；【结构材料】陶瓷基复合材料(202412)

2D SiC_f/SiC中温热冲击损伤与面内剪切性能退化规律

由博杰¹(), 李博¹^,², 李旭勤³, 马雪寒¹, 张毅¹(), 成来飞¹

1.西北工业大学超高温结构复合材料重点实验室, 西安710072
2.陕西科技大学材料科学与工程学院, 西安710021
3.成都工业学院材料与环境工程学院, 成都 611730

收稿日期:2024-06-04 修回日期:2024-08-08 出版日期:2024-08-19 网络出版日期:2024-08-19
通讯作者: 张毅, 副研究员. E-mail: zhangyit@nwpu.edu.cn
作者简介:由博杰(2001-), 男, 硕士研究生. E-mail: youbojie@mail.nwpu.edu.cn
基金资助:
航空发动机及燃气轮机基础科学中心重点项目(P2022-B-Ⅳ-002-001);西北工业大学研究生实践创新基金(PF2024004)

Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiC_f/SiC at Medium Temperature

YOU Bojie¹(), LI Bo¹^,², LI Xuqin³, MA Xuehan¹, ZHANG Yi¹(), CHENG Laifei¹

1. Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
2. School of Materials Science and Engineering, Shaanxi University of Science & Technology, Xi’an 710021, China
3. School of Materials and Environmental Engineering, Chengdu Technological University, Chengdu 611730, China

Received:2024-06-04 Revised:2024-08-08 Published:2024-08-19 Online:2024-08-19
Contact: ZHANG Yi, associate professor. E-mail: zhangyit@nwpu.edu.cn
About author:YOU Bojie (2001-), male, Master candidate. E-mail: youbojie@mail.nwpu.edu.cn
Supported by:
Science Center for Gas Turbine Project(P2022-B-Ⅳ-002-001);Practice and Innovation Funds for Graduate Students of Northwestern Polytechnical University(PF2024004)

摘要/Abstract

摘要：

SiC_f/SiC复合材料热冲击损伤是航空发动机热端部件应用中需要解决的关键问题。本研究利用全自动精准控温的热冲击设备, 在1200 ℃测试了2D SiC_f/SiC的热冲击性能, 拟探究热冲击损伤与面内剪切性能退化之间的相关性。结果表明, 随着热冲击次数增加, 2D SiC_f/SiC涂层表面出现硼硅酸盐玻璃(BSG)气泡, SiC基体氧化, BN界面脱黏加剧, 但并未影响基体开裂、纤维桥联等损伤机制。因此, 2D SiC_f/SiC的面内剪切应力-应变曲线依然呈双线性。热冲击产生的热膨胀失配及SiC基体氧化导致面剪模量由78.5 GPa降低至63.6 GPa, 面剪比例极限应力由128.9 MPa降低至99.3 MPa, 面剪强度由205.8 MPa降低至187.3 MPa。根据面内剪切混合定律, BN界面脱黏加剧是剪切模量退化的关键因素。基体开裂应力公式表明, 氧化后SiC基体体积分数下降, 进一步降低了面剪比例极限应力。基于修正刚体块滑移模型, 利用纤维台阶间距能够有效预测面剪强度的下降规律, 且理论计算结果与实际值误差小于20%。

关键词: 2D SiC_f/SiC, 化学气相渗透, 抗热冲击行为, 面剪性能, 退化

Abstract:

Degradation of SiC_f/SiC composites in-plane shear performance after thermal shock represents a significant challenge for the development of hot-end components in aero-engines. In this study, thermal shock performance of 2D SiC_f/SiC was evaluated by using precision temperature-controlled thermal shock equipment, and correlation between thermal shock and in-plane shear performance was established. The results showed that borosilicate glass (BSG) coating caused SiC matrix forming BSG bubbles and oxidation, while BN interfacial debonding worsened with increasing number of thermal shocks. However, the thermal shock did not affect matrix cracking and fiber bridging. Furthermore, the in-plane shear stress-strain curve maintained bilinear trend. The degradation of the in-plane shear mechanism was attributed to the thermal expansion mismatch and the oxidation of SiC matrix. The in-plane shear modulus decreased from 78.5 to 63.6 GPa, the in-plane proportional limit stress decreased from 128.9 to 99.3 MPa, and the in-plane shear stress decreased from 205.8 to 187.3 MPa. According to the in-plane shear mixing rules, the degradation of shear modulus was caused by increased interface debonding. Combined with matrix cracking stress equation, this indicated that volume fraction decreased due to SiC matrix oxidation, resulting in degradation of proportional limit stress. Based on modified rigid body sliding model, using fiber step spacing could predict the degradation of in-plane shear strength after thermal shock, with the error between the theoretical calculation results and the actual values less than 20%.

Key words: 2D SiC_f/SiC, chemical vapor infiltration, thermal shock resistance, shear performance, degradation

中图分类号:

TB332

由博杰, 李博, 李旭勤, 马雪寒, 张毅, 成来飞. 2D SiC_f/SiC中温热冲击损伤与面内剪切性能退化规律[J]. 无机材料学报, 2024, 39(12): 1367-1376.

YOU Bojie, LI Bo, LI Xuqin, MA Xuehan, ZHANG Yi, CHENG Laifei. Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiC_f/SiC at Medium Temperature[J]. Journal of Inorganic Materials, 2024, 39(12): 1367-1376.

图/表 14

图1 热冲击循环试验及控温曲线

Fig. 1 Thermal shock test and temperature control curves (a) Thermal shock test furnace; (b) Principle of test; (c) Cycling curve; (d) Single cycle

图2 2D SiCf/SiC面内剪切应力-应变曲线

Fig. 2 In-plane shear stress-strain curves of 2D SiCf/SiC

图3 2D SiCf/SiC面内剪切性能

Fig. 3 In-plane shear properties of 2D SiCf/SiC (a) Proportional limit stress; (b) Shear strength; (c) Young’s modulus; (d) Modulus of resilience; (e) Modulus of toughness

图4 2D SiCf/SiC表面微结构演化

Fig. 4 Microstructure evolution of 2D SiCf/SiC surfaces (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

图5 2D SiCf/SiC的XRD谱图(a)及晶粒尺寸变化(b)

Fig. 5 XRD patterns (a) and grain size changes (b) of 2D SiCf/SiC

图6 2D SiCf/SiC截面微结构演化

Fig. 6 Cross-sectional microstructure evolution of 2D SiCf/SiC (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

图7 2D SiCf/SiC剪切界面脱黏和台阶间距演变

Fig. 7 Debonding and step spacing evolution at 2D SiCf/SiC shear interface (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

图8 2D SiCf/SiC的断口微结构形貌

Fig. 8 Fracture microstructure morphologies of 2D SiCf/SiC (a, b) As-received; (c, d) After 250 cycles; (e, f) After 500 cycles; (g, h) After 750 cycles

图9 2D SiCf/SiC纤维断口形貌

Fig. 9 Fracture morphologies of 2D SiCf/SiC fibers (a) As-received; (b) After 250 cycles; (c) After 500 cycles; (d) After 750 cycles; (e) Brittle fracture; (f) Toughness fracture

图10 热冲击及剪切界面脱黏机制

Fig. 10 Mechanisms of thermal shock and shear interface debonding (a)Thermal shock interface debonding; (b) Shear strain relationship

表1 参数数值统计

Table 1 Parameter value statistics

Parameter	Symbol	Value
Poisson’s ration of SiC fiber	v_f	0.20
Poisson’s ration of SiC matrix	v_m	0.17
Fiber volume fraction	V_f/%	0.35
Matrix cracking energy	${{\Gamma }_{\text{m}}}~$/(N·m^-1)	6.0
Interface sliding stress	${{\tau }_{\text{s}}}$/MPa	9.2
Thickness of plain woven layer	${{t}_{\text{layer}}}$/mm	0.2
SiC fiber diameter	${{d}_{\text{f}}}$/μm	12.0
SiC fiber modulus	${{E}_{\text{f}}}$/GPa	386.7
SiC matrix modulus	${{E}_{\text{m}}}$/GPa	350.0
SiC fiber shear modulus	${{G}_{\text{f}}}/$GPa	161.1
SiC matrix shear modulus	${{G}_{\text{m}}}$/GPa	149.6
BN interface shear modulus	${{G}_{\text{I}}}$/GPa	110.0

表2 剪切模量计算理论值与实际值对比

Table 2 Comparison of theoretical and actual values for shear modulus calculation

Thermal shock cycles	Percentage of debonding/ %	Theoretical value/ GPa	Actual value/ GPa	Error/ %
0	0	80.4	78.5	-2.4
250	5.56	78.2	83.6	6.9
500	13.90	74.6	58.6	-21.4
750	56.10	50.0	63.6	27.2

图11 热冲击氧化起泡机制

Fig. 11 Mechanism of thermal shock oxidation blistering

表3 面内剪切强度计算理论值与实际值对比

Table 3 Comparison of theoretical and actual shear strength values

Thermal shock cycles	Fiber step spacing/ mm	Theoretical value/ MPa	Actual value/ MPa	Error/ %
0	79.0	178.6	205.8	15.2
250	97.5	193.4	209.6	8.4
500	49.0	162.6	186.5	14.7
750	67.3	170.8	187.3	9.7

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2D SiC_f/SiC中温热冲击损伤与面内剪切性能退化规律

Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiC_f/SiC at Medium Temperature

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2D SiCf/SiC中温热冲击损伤与面内剪切性能退化规律

Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiCf/SiC at Medium Temperature

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2D SiC_f/SiC中温热冲击损伤与面内剪切性能退化规律

Thermal Shock Damage and In-plane Shear Performance Degradation of 2D SiC_f/SiC at Medium Temperature